XC4VLX15-10SFG363C

The XC4VLX15-10SFG363C is a Virtex‑4 LX field programmable gate array (FPGA) designed to provide configurable digital logic, on‑chip memory, and high pin count I/O in a compact package. It delivers a combination of logic capacity, embedded RAM, and a broad I/O complement suitable for designs that require dense programmable logic and flexible interfacing.

With 13,824 logic elements, approximately 0.9 Mbits of embedded memory, and 240 user I/Os in a 363‑FBGA (17 × 17) surface‑mount package, the device targets commercial‑grade applications operating across a 0 °C to 85 °C range while meeting RoHS environmental requirements.

Key Features

• Core Capacity — 13,824 logic elements and 1,536 logic blocks provide substantial programmable logic resources for implementing custom digital functions.
• Embedded Memory — Approximately 0.9 Mbits (884,736 bits) of on‑chip RAM for buffering, state storage, and memory‑mapped logic.
• I/O Resources — 240 user I/Os to support high‑density external interfacing and parallel signal connectivity.
• Power Supply — Operates from a core supply range of 1.14 V to 1.26 V, allowing integration into regulated power domains.
• Package & Mounting — 363‑FBGA (supplier device package: 363‑FCBGA, 17 × 17) in a surface‑mount form factor for board‑level integration.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant materials.

Typical Applications

• Custom digital logic implementations — Use the device's 13,824 logic elements to realize application‑specific processing, control, and protocol logic.
• On‑chip buffering and memory tasks — Leverage approximately 0.9 Mbits of embedded RAM for data buffering, FIFOs, and temporary storage close to logic.
• High‑density I/O interfacing — Employ 240 user I/Os to connect to wide parallel buses, numerous peripherals, or multi‑lane interfaces.

Unique Advantages

• Substantial programmable logic: 13,824 logic elements enable complex state machines, datapaths, and custom accelerators without external logic.
• Integrated memory reduces BOM: Nearly 0.9 Mbits of on‑chip RAM minimizes the need for external memory in many buffering and control scenarios.
• High I/O count: 240 user I/Os support dense connectivity and simplify board‑level routing for multi‑interface designs.
• Compact BGA packaging: 363‑FBGA (17 × 17) surface‑mount package delivers high density in a compact footprint suitable for space‑constrained PCBs.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS‑compliant construction for standard commercial deployments.

Why Choose XC4VLX15-10SFG363C?

The XC4VLX15-10SFG363C positions itself as a balanced solution for commercial designs that require a mix of programmable logic capacity, embedded memory, and substantial I/O in a single component. Its logic element count and on‑chip RAM enable consolidated implementations that can reduce external components and streamline board design.

Engineers targeting scalable custom logic, high‑density interfacing, or designs constrained by board space will find the 363‑FBGA package, surface‑mount mounting, and defined voltage and temperature ranges conducive to integration. RoHS compliance provides an added environmental assurance for commercial product assemblies.

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