XC4VLX15-11FF676I

The XC4VLX15-11FF676I is a Virtex®-4 LX FPGA manufactured by AMD, offered in a 676-ball FCBGA package. It provides a mid-range logic capacity and on-chip memory suitable for industrial-grade embedded and control applications.

With 13,824 logic elements across 1,536 CLBs, approximately 0.885 Mbits of embedded memory, and up to 320 user I/Os, this device targets designs that require balanced logic density, substantial I/O count, and operation across an industrial temperature range.

Key Features

• Logic Capacity  1536 CLBs delivering 13,824 logic elements for implementing medium-complexity digital designs.
• On‑Chip Memory  Approximately 0.885 Mbits of embedded RAM for buffering, LUT-based storage, and small data caches.
• I/O Count  Up to 320 user I/Os to support multiple parallel interfaces, sensor connections, and bus implementations.
• Power Supply  Supported core voltage range of 1.14 V to 1.26 V to guide power-supply design and BOM selection.
• Package & Mounting  676-BBGA (676-FCBGA, 27×27) ball-grid array; surface-mount package for compact PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environmental conditions.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement motor control, PLC interfaces, and I/O aggregation where industrial temperature operation and robust I/O counts are required.
• Embedded Processing  Use as a mid-range programmable fabric for custom logic, glue logic, and hardware acceleration in embedded systems.
• Communications & Networking  Deploy for protocol bridging, packet processing, or interface adaptation tasks that benefit from multiple I/Os and on-chip memory.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with ~0.885 Mbits of embedded RAM enable a mix of compute and storage on a single device.
• High I/O Density: 320 user I/Os simplify connectivity to peripherals, sensors, and external interfaces without extra components.
• Industrial Temperature Support: Rated −40 °C to 100 °C to meet environmental requirements for factory-floor and outdoor equipment.
• Compact BGA Package: 676-FCBGA (27×27) surface-mount package reduces PCB footprint while providing a high pin-count solution.
• Defined Core Voltage Range: 1.14 V–1.26 V supply specification aids accurate power-supply design and thermal planning.
• RoHS Compliant: Environmentally compliant for designs requiring restricted-substance adherence.

Why Choose XC4VLX15-11FF676I?

The XC4VLX15-11FF676I positions itself as a practical choice for designers needing a mid-range Virtex-4 LX FPGA with a solid combination of logic elements, embedded memory, and a high I/O count, all in a compact 676-FCBGA package. Its industrial temperature rating and defined core-voltage window make it suitable for deployed systems that require predictable electrical and environmental characteristics.

This AMD-manufactured device fits projects that require on-board programmable logic for control, interface, or processing tasks while maintaining a compact board footprint and RoHS compliance. It provides a clear specification set for power budgeting, thermal design, and I/O planning in production hardware.

Request a quote or submit an inquiry for XC4VLX15-11FF676I to receive pricing and availability information tailored to your project needs.