XC4VLX15-10SFG363I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 884736 13824 363-FBGA, FCBGA |
|---|---|
| Quantity | 563 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC4VLX15-10SFG363I – Virtex®-4 LX Field Programmable Gate Array (FPGA), 363-FBGA, Industrial
The XC4VLX15-10SFG363I is a Virtex-4 LX Field Programmable Gate Array in a 363-FBGA (17×17) package, offered in an industrial-grade variant. It provides a balance of on-chip logic, embedded memory, and I/O resources for designs that require programmable digital logic with controlled power and temperature ranges.
Key device data includes 13,824 logic elements, approximately 0.885 Mbits of embedded memory, 240 user I/Os, a 1.14 V to 1.26 V supply range, and an operating temperature range of –40 °C to 100 °C. The device is RoHS compliant and designed for surface-mount PCB assembly.
Key Features
- Core Logic 13,824 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
- Embedded Memory Approximately 0.885 Mbits of on-chip RAM for data buffering, FIFOs, and small lookup tables integrated alongside logic resources.
- I/O Capacity 240 user I/Os support interfacing with multiple peripherals, buses, and external devices from a single FPGA package.
- Power Supply Nominal core supply range of 1.14 V to 1.26 V to match system power-rail planning and regulation requirements.
- Package & Mounting 363-FBGA (17×17) FCBGA package in a surface-mount form factor for high-density board designs.
- Temperature & Grade Industrial operating temperature range of –40 °C to 100 °C for deployment in thermally challenging environments.
- Environmental Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
Typical Applications
- Custom digital logic and prototyping Implement and iterate complex state machines, protocol bridges, and custom accelerators using the device's logic and embedded memory.
- High-density I/O systems Consolidate multiple peripheral interfaces or data streams through 240 configurable I/Os in a compact FBGA package.
- Embedded system integration Use the combination of logic elements and on-chip RAM to integrate control, signal processing, and buffering tasks within a single programmable device.
Unique Advantages
- Rich logic resources: 13,824 logic elements allow designers to implement substantial custom logic without immediate migration to larger devices.
- On-chip memory: Approximately 0.885 Mbits of embedded RAM reduces the need for external memory for many buffering and temporary storage needs.
- High I/O count: 240 user I/Os enable dense interfacing and system consolidation, lowering overall BOM complexity.
- Industrial temperature range: Rated from –40 °C to 100 °C for reliable operation across a wide set of deployment environments.
- Compact, surface-mount package: 363-FBGA (17×17) supports space-constrained PCB layouts while delivering high pin density.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing flows.
Why Choose XC4VLX15-10SFG363I?
The XC4VLX15-10SFG363I positions itself as a versatile Virtex-4 LX FPGA option where a combination of moderate logic capacity, on-chip memory, and substantial I/O is required in an industrial-grade package. Its defined supply and temperature ranges, along with a high-density 363-FBGA footprint, make it suitable for embedded designs that prioritize integration and predictable electrical and thermal behavior.
This device is appropriate for engineering teams seeking a programmable hardware platform that ties specific, verifiable resources—logic elements, embedded RAM, I/O count, package dimensions, and industrial temperature rating—into a single component backed by the Virtex-4 LX family pedigree.
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