XC4VLX15-10FFG676C

The XC4VLX15-10FFG676C is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD. This device provides a balanced combination of logic capacity, on-chip memory, and I/O density in a 676-ball FCBGA package for surface-mount board designs.

Key delivered resources include 13,824 logic elements, approximately 0.885 Mbits of embedded memory, and 320 user I/O pins, coupled with a 1.14 V to 1.26 V supply range and a commercial operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic  13,824 logic elements suitable for moderate-density digital designs and custom logic implementations.
• Embedded Memory  Approximately 0.885 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density  320 user I/O pins to support multiple parallel interfaces and external device connections.
• Power  Operates from a core voltage supply of 1.14 V to 1.26 V, enabling predictable power planning for the core domain.
• Package & Mounting  676-ball FCBGA package (676-FCBGA, 27 × 27 mm) designed for surface-mount PCB assembly.
• Operating Range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• High-density digital logic  Use the device’s 13,824 logic elements to implement medium-complexity custom logic, state machines, and glue logic on compact PCBs.
• Embedded memory buffering  Approximately 0.885 Mbits of on-chip RAM supports data buffering, small FIFOs, and lookup table storage within system designs.
• Multi-interface connectivity  320 I/O pins enable integration of parallel buses, peripheral interfaces, and multiple low-pin-count subsystems on a single FPGA.
• Compact board-level integration  The 676-FCBGA (27 × 27 mm) surface-mount package allows dense placement for space-constrained applications that require a commercial-grade FPGA.

Unique Advantages

• Balanced logic and memory capacity: 13,824 logic elements coupled with approximately 0.885 Mbits of embedded RAM provide a practical mix for many mid-range FPGA tasks without external memory dependence.
• High I/O count: 320 user I/Os simplify board-level integration of multiple interfaces and parallel signals, reducing the need for additional interface components.
• Predictable power envelope: A defined core voltage range of 1.14 V to 1.26 V helps streamline power-supply design and margin planning.
• Surface-mount package for compact designs: The 676-ball FCBGA (27 × 27 mm) package enables high-density PCB layouts and reliable SMT assembly.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial design requirements.

Why Choose XC4VLX15-10FFG676C?

The XC4VLX15-10FFG676C positions itself as a versatile, commercial-grade Virtex®-4 LX FPGA that combines mid-range logic capacity, embedded memory, and substantial I/O in a compact 676-FCBGA footprint. It is suited to designers who need a reliable, RoHS-compliant FPGA with clear electrical and thermal envelopes for board-level integration.

This part is appropriate for projects that require a balance of on-chip resources and I/O density while operating within standard commercial temperature and supply ranges, offering a scalable option within Virtex®-4 LX device choices.

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