XC4VLX15-10FFG668C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 320 884736 13824 668-BBGA, FCBGA |
|---|---|
| Quantity | 503 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC4VLX15-10FFG668C – Virtex®-4 LX FPGA, 668-FCBGA (27×27), Commercial
The XC4VLX15-10FFG668C is a Virtex-4 LX field programmable gate array in a 668-ball FCBGA package. It provides a balance of programmable logic capacity, on‑chip memory, and I/O density for commercial-grade embedded and digital designs. Key value comes from its combination of 13,824 logic elements, approximately 0.84 Mbits of embedded RAM, and 320 user I/O signals in a compact surface-mount package.
Key Features
- Logic Capacity — 13,824 logic elements (configured cells) to implement combinational and sequential logic functions.
- Configurable Logic Blocks (CLBs) — 1,536 CLB units providing the fabric for routing and logic implementation.
- Embedded Memory — Approximately 0.84 Mbits of on-chip RAM for buffering, state storage, and small data structures.
- I/O Density — 320 user I/O pins to support wide parallel interfaces and multiple external peripherals.
- Power and Supply — Core voltage range of 1.14 V to 1.26 V for device core power requirements.
- Package and Mounting — 668-FCBGA (27×27) package, surface-mount mounting type for compact board-level integration.
- Operating Conditions — Commercial operating temperature range from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- Substantial programmable logic: 13,824 logic elements offer the resources needed for mid-range FPGA designs without overprovisioning.
- On‑chip memory for local buffering: Approximately 0.84 Mbits of embedded RAM reduces dependency on external memory for small to moderate data storage.
- High I/O count: 320 I/O pins support multi-device interfaces, parallel peripherals, and flexible board partitioning.
- Compact FCBGA packaging: 668-ball FCBGA (27×27) enables high-density board layouts with surface-mount assembly.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation to match general-purpose embedded and electronic product environments.
- Regulatory consideration: RoHS compliance supports environmental and manufacturing requirements.
Why Choose XC4VLX15-10FFG668C?
The XC4VLX15-10FFG668C positions itself as a practical choice for designs that need a balanced mix of logic capacity, embedded memory, and plentiful I/O in a compact surface-mount FCBGA package. Its specification set — 13,824 logic elements, roughly 0.84 Mbits of RAM, 320 I/Os, and a 668-ball package — makes it suitable for commercial embedded systems where board space, I/O flexibility, and on-chip resources are key considerations.
Choosing this device provides a straightforward path to scale and integration within the Virtex®-4 LX product family footprint and supports compliance with RoHS requirements for environmentally conscious manufacturing.
Request a quote or submit a parts inquiry to receive pricing and availability information for the XC4VLX15-10FFG668C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








