XC4VLX15-10FFG668C

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 320 884736 13824 668-BBGA, FCBGA

Quantity 503 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells13824
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC4VLX15-10FFG668C – Virtex®-4 LX FPGA, 668-FCBGA (27×27), Commercial

The XC4VLX15-10FFG668C is a Virtex-4 LX field programmable gate array in a 668-ball FCBGA package. It provides a balance of programmable logic capacity, on‑chip memory, and I/O density for commercial-grade embedded and digital designs. Key value comes from its combination of 13,824 logic elements, approximately 0.84 Mbits of embedded RAM, and 320 user I/O signals in a compact surface-mount package.

Key Features

  • Logic Capacity — 13,824 logic elements (configured cells) to implement combinational and sequential logic functions.
  • Configurable Logic Blocks (CLBs) — 1,536 CLB units providing the fabric for routing and logic implementation.
  • Embedded Memory — Approximately 0.84 Mbits of on-chip RAM for buffering, state storage, and small data structures.
  • I/O Density — 320 user I/O pins to support wide parallel interfaces and multiple external peripherals.
  • Power and Supply — Core voltage range of 1.14 V to 1.26 V for device core power requirements.
  • Package and Mounting — 668-FCBGA (27×27) package, surface-mount mounting type for compact board-level integration.
  • Operating Conditions — Commercial operating temperature range from 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • Substantial programmable logic: 13,824 logic elements offer the resources needed for mid-range FPGA designs without overprovisioning.
  • On‑chip memory for local buffering: Approximately 0.84 Mbits of embedded RAM reduces dependency on external memory for small to moderate data storage.
  • High I/O count: 320 I/O pins support multi-device interfaces, parallel peripherals, and flexible board partitioning.
  • Compact FCBGA packaging: 668-ball FCBGA (27×27) enables high-density board layouts with surface-mount assembly.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation to match general-purpose embedded and electronic product environments.
  • Regulatory consideration: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC4VLX15-10FFG668C?

The XC4VLX15-10FFG668C positions itself as a practical choice for designs that need a balanced mix of logic capacity, embedded memory, and plentiful I/O in a compact surface-mount FCBGA package. Its specification set — 13,824 logic elements, roughly 0.84 Mbits of RAM, 320 I/Os, and a 668-ball package — makes it suitable for commercial embedded systems where board space, I/O flexibility, and on-chip resources are key considerations.

Choosing this device provides a straightforward path to scale and integration within the Virtex®-4 LX product family footprint and supports compliance with RoHS requirements for environmentally conscious manufacturing.

Request a quote or submit a parts inquiry to receive pricing and availability information for the XC4VLX15-10FFG668C.

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