XC4VLX15-10FF668C

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 320 884736 13824 668-BBGA, FCBGA

Quantity 113 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells13824
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC4VLX15-10FF668C – Virtex®-4 LX FPGA, 320 I/Os

The XC4VLX15-10FF668C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) from AMD. It combines programmable logic, on-chip memory, and a high-pin-count package to support board-level designs that require substantial logic capacity and I/O connectivity.

This device provides 13,824 logic elements, approximately 0.885 Mbits of embedded memory, and 320 I/Os in a 668-ball FCBGA package, with a commercial operating temperature range and RoHS compliance.

Key Features

  • Core Logic 13,824 logic elements (cells) to implement moderate-complexity programmable logic and custom digital functions.
  • Embedded Memory Approximately 0.885 Mbits of on-chip RAM to store data, buffers, and state without immediate need for external memory.
  • I/O Capacity 320 general-purpose I/Os to interface with peripherals, buses, and external devices.
  • Power Specified core supply voltage range of 1.14 V to 1.26 V for power-rail planning and board-level supply design.
  • Package & Mounting 668-BBGA (668-FCBGA, 27×27 mm) ball grid array in a surface-mount package for high pin-count, compact board layouts.
  • Temperature & Grade Commercial grade operation from 0 °C to 85 °C to suit standard commercial applications.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Board-level FPGA integration — Acts as programmable logic for custom I/O control, glue logic, and protocol adaptation on populated PCBs.
  • Prototyping and development — Provides sufficient logic and memory resources for evaluation and early hardware development efforts.
  • I/O-dense interfaces — Suits designs that require many external connections, leveraging the 320 available I/Os for peripheral and bus interfaces.
  • Embedded logic acceleration — Implements custom data-paths and control logic using the device’s logic elements and on-chip memory.

Unique Advantages

  • Substantial logic capacity: 13,824 logic elements enable integration of complex digital functions on a single FPGA.
  • On-chip RAM: Approximately 0.885 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
  • High I/O count: 320 I/Os provide broad interfacing options for multi-signal systems and peripheral attachments.
  • Compact, high-pin package: 668-ball FCBGA (27×27 mm) offers a high pin count in a compact surface-mount form factor for dense PCB designs.
  • Defined power envelope: Narrow core voltage range (1.14–1.26 V) simplifies core power-rail specification and margin analysis.
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployment scenarios.

Why Choose XC4VLX15-10FF668C?

The XC4VLX15-10FF668C positions itself as a commercial-grade Virtex®-4 LX FPGA that balances logic density, embedded memory, and a high number of I/Os in a compact FCBGA package. Its specification set is suited to designers seeking a single-chip programmable solution for moderate-complexity digital designs that require significant I/O connectivity.

Manufactured by AMD and RoHS compliant, this device is appropriate for projects that need a stable commercial-temperature FPGA platform with clearly defined power and package characteristics.

Request a quote for XC4VLX15-10FF668C today to discuss availability and pricing for your next design.

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