XC4VLX15-10FF676C

The XC4VLX15-10FF676C is a Virtex®-4 LX field programmable gate array (FPGA) in a 676-ball FCBGA package manufactured by AMD. It integrates 13,824 logic elements and approximately 0.885 Mbits of embedded memory alongside 320 user I/O pins to support complex, board-level programmable logic implementations.

Designed for commercial-grade applications, the device operates from a core supply range of 1.14 V to 1.26 V and supports surface-mount assembly in a 27 mm × 27 mm 676-FCBGA footprint, with an ambient operating range of 0 °C to 85 °C.

Key Features

• Core Logic  13,824 logic elements provide the programmable fabric for custom digital logic and control functions.
• Logic Blocks  Device includes 1,536 CLB-equivalent resources for partitioning and implementing logic designs.
• Embedded Memory  Approximately 0.885 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity  320 user I/O pins enable connectivity to external peripherals, buses, and daughtercards.
• Power  Core voltage supply range of 1.14 V to 1.26 V for stable FPGA operation.
• Package & Mounting  676-ball FCBGA (27 × 27 mm) package designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Use the FPGA’s 13,824 logic elements to implement and iterate on bespoke digital architectures.
• Embedded controllers and interfaces  320 I/O pins support interfacing to multiple peripherals and control buses in board-level designs.
• On-chip data buffering  Approximately 0.885 Mbits of embedded memory provides local storage for small buffering, state machines, and lookup tables.

Unique Advantages

• High logic density: 13,824 logic elements enable substantial on-chip functionality without external programmable devices.
• Generous I/O count: 320 I/O pins allow flexible connectivity options for complex board-level integrations.
• Compact footprint: 676-FCBGA (27 × 27 mm) package balances density and board-space efficiency for surface-mount designs.
• On-chip memory: Approximately 0.885 Mbits of embedded RAM reduces reliance on external memory for modest buffering and state storage.
• Commercial operating range: Rated 0 °C to 85 °C to match typical commercial deployment environments.
• Regulatory compliance: RoHS compliant for environmental and manufacturing consistency.

Why Choose XC4VLX15-10FF676C?

The XC4VLX15-10FF676C positions itself as a practical solution for designers who need a balance of logic capacity, I/O bandwidth, and on-chip memory within a compact FCBGA package. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of board-level programmable logic applications where verified, manufacturer-specified parameters are required.

For engineering teams focused on integration and prototyping, this device offers deterministic hardware resources—13,824 logic elements, 320 I/Os, and embedded RAM—that help simplify BOMs and accelerate design iterations while maintaining RoHS compliance.

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