XC4VLX15-10SF363C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 884736 13824 363-FBGA, FCBGA |
|---|---|
| Quantity | 816 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 363-FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 363-FBGA, FCBGA | Number of I/O | 240 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 884736 |
Overview of XC4VLX15-10SF363C – Virtex®-4 LX Field Programmable Gate Array, 363-FBGA
The XC4VLX15-10SF363C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) in a 363-FBGA (17×17) surface-mount package. It provides a combination of programmable logic, embedded RAM and a substantial I/O count for board-level digital designs.
With 13,824 logic elements, approximately 0.885 Mbits of embedded memory and 240 I/O pins, this commercial-grade FPGA targets applications that require balanced logic capacity, on-chip memory and flexible interfacing while operating within a 0 °C to 85 °C range.
Key Features
- Logic Capacity — 13,824 logic elements to implement custom digital logic, state machines and control functions.
- Embedded Memory — Approximately 0.885 Mbits (884,736 bits) of on-chip RAM for buffering, lookup tables and local data storage.
- Programmable I/O — 240 user I/O pins to support parallel interfaces, GPIO and board-level connectivity.
- Power — Core voltage supply range of 1.14 V to 1.26 V for system power design and regulator selection.
- Package & Mounting — 363-FBGA (17×17) supplier device package in a surface-mount form factor for compact PCB integration.
- Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C suitable for standard temperature environments.
- Compliance — RoHS compliant to support lead-free manufacturing requirements.
Unique Advantages
- Substantial Logic Resources: 13,824 logic elements enable implementation of moderate-complexity digital systems without external ASICs.
- On-chip Memory: Approximately 0.885 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
- High I/O Count: 240 I/O pins provide flexibility for interfacing multiple peripherals and parallel buses directly on-chip.
- Compact FBGA Package: 363-FBGA (17×17) allows a high-density footprint for space-constrained PCB layouts while using surface-mount assembly.
- Predictable Power Envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply selection and design verification.
- Production-ready Compliance: RoHS compliance supports current lead-free manufacturing flows.
Why Choose XC4VLX15-10SF363C?
The XC4VLX15-10SF363C offers a practical balance of logic capacity, embedded memory and I/O resources in a compact 363-FBGA package for commercial-temperature designs. Its specification set makes it well suited for projects that need on-chip RAM and significant user I/O while maintaining a predictable power profile.
Choose this part when your design requires an FPGA with clear, quantifiable resources—13,824 logic elements, approximately 0.885 Mbits of embedded memory and 240 I/O—in a surface-mount FBGA package with RoHS compliance and commercial-grade temperature operation.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC4VLX15-10SF363C.

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