XC4VLX15-10SF363C

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 884736 13824 363-FBGA, FCBGA

Quantity 816 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells13824
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC4VLX15-10SF363C – Virtex®-4 LX Field Programmable Gate Array, 363-FBGA

The XC4VLX15-10SF363C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) in a 363-FBGA (17×17) surface-mount package. It provides a combination of programmable logic, embedded RAM and a substantial I/O count for board-level digital designs.

With 13,824 logic elements, approximately 0.885 Mbits of embedded memory and 240 I/O pins, this commercial-grade FPGA targets applications that require balanced logic capacity, on-chip memory and flexible interfacing while operating within a 0 °C to 85 °C range.

Key Features

  • Logic Capacity — 13,824 logic elements to implement custom digital logic, state machines and control functions.
  • Embedded Memory — Approximately 0.885 Mbits (884,736 bits) of on-chip RAM for buffering, lookup tables and local data storage.
  • Programmable I/O — 240 user I/O pins to support parallel interfaces, GPIO and board-level connectivity.
  • Power — Core voltage supply range of 1.14 V to 1.26 V for system power design and regulator selection.
  • Package & Mounting — 363-FBGA (17×17) supplier device package in a surface-mount form factor for compact PCB integration.
  • Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C suitable for standard temperature environments.
  • Compliance — RoHS compliant to support lead-free manufacturing requirements.

Unique Advantages

  • Substantial Logic Resources: 13,824 logic elements enable implementation of moderate-complexity digital systems without external ASICs.
  • On-chip Memory: Approximately 0.885 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
  • High I/O Count: 240 I/O pins provide flexibility for interfacing multiple peripherals and parallel buses directly on-chip.
  • Compact FBGA Package: 363-FBGA (17×17) allows a high-density footprint for space-constrained PCB layouts while using surface-mount assembly.
  • Predictable Power Envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply selection and design verification.
  • Production-ready Compliance: RoHS compliance supports current lead-free manufacturing flows.

Why Choose XC4VLX15-10SF363C?

The XC4VLX15-10SF363C offers a practical balance of logic capacity, embedded memory and I/O resources in a compact 363-FBGA package for commercial-temperature designs. Its specification set makes it well suited for projects that need on-chip RAM and significant user I/O while maintaining a predictable power profile.

Choose this part when your design requires an FPGA with clear, quantifiable resources—13,824 logic elements, approximately 0.885 Mbits of embedded memory and 240 I/O—in a surface-mount FBGA package with RoHS compliance and commercial-grade temperature operation.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC4VLX15-10SF363C.

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