XC4VLX15-11SF363I

The XC4VLX15-11SF363I is a Virtex®-4 LX Field Programmable Gate Array (FPGA) from AMD. It provides 13,824 logic elements and approximately 0.885 Mbits of embedded memory in a 363-FBGA (17×17) surface-mount package.

Specified for industrial use with an operating range of −40 °C to 100 °C and a supply voltage window of 1.14 V to 1.26 V, this device targets applications requiring a combination of logic density, on-chip memory, and a high I/O count.

Key Features

• Core Logic  13,824 logic elements provide significant programmable logic resources for custom digital designs.
• Embedded Memory  Approximately 0.885 Mbits of on-chip RAM for data buffering, state storage, and local memory functions.
• I/O Density  240 I/O pins support a wide range of external interfaces and parallel connections.
• Package and Mounting  363-FBGA (363-FCBGA, 17×17) surface-mount package for compact PCB implementations.
• Power  Operates from a core voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Industrial Temperature Range  Rated for −40 °C to 100 °C to meet industrial-environment thermal requirements.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and materials.

Typical Applications

• Industrial control systems  Industrial-grade temperature rating and high I/O count enable interfacing with sensors, actuators, and field I/O modules.
• Embedded processing and prototyping  Large logic-resource count and on-chip RAM support custom logic development and prototype implementations.
• High-density I/O designs  240 I/Os accommodate parallel buses, multi-channel interfaces, and extensive peripheral connectivity.

Unique Advantages

• High logic capacity: 13,824 logic elements allow implementation of complex custom logic and multiple concurrent functions on a single device.
• On-chip memory: Approximately 0.885 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Robust I/O resources: 240 I/Os provide flexibility for complex interfacing and system partitioning without additional glue logic.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact BGA package: 363-FBGA (17×17) package enables high-density board designs while retaining surface-mount assembly compatibility.
• RoHS compliance: Conforms to RoHS requirements for environmentally conscious manufacturing.

Why Choose XC4VLX15-11SF363I?

The XC4VLX15-11SF363I combines substantial programmable logic resources, embedded memory, and a high I/O count in an industrial-grade FPGA package. Its operating voltage range and thermal rating make it suitable for designs where reliable operation across a broad temperature span is required.

This device is appropriate for engineers and designers building industrial and embedded systems that require on-chip logic density, local memory, and extensive external connectivity while adhering to RoHS requirements.

Request a quote or submit a request for pricing and availability for the XC4VLX15-11SF363I to receive detailed commercial information.