XC4VLX160-10FF1148C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 5308416 152064 1148-BBGA, FCBGA |
|---|---|
| Quantity | 859 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16896 | Number of Logic Elements/Cells | 152064 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5308416 |
Overview of XC4VLX160-10FF1148C – Virtex®-4 LX FPGA, 152,064 Logic Elements, 1148-BBGA
The XC4VLX160-10FF1148C is a Virtex®-4 LX field programmable gate array optimized for designs that require high logic density, substantial on-chip memory, and a large number of I/O connections. Its architecture delivers a combination of logic capacity, embedded RAM, and flexible I/O suitable for demanding digital processing, communications, and prototyping applications.
Packaged in a 1148-ball FCBGA, the device supports surface-mount assembly and operates from a core supply range of 1.14 V to 1.26 V. It is rated for commercial-grade operation from 0 °C to 85 °C and is RoHS compliant.
Key Features
- Logic Capacity Provides 152,064 logic elements to implement complex digital functions and large-scale logic designs.
- Embedded Memory Approximately 5.3 Mbits of on-chip RAM for buffering, storage, and local data processing needs.
- High I/O Count 768 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive peripheral integration.
- Package 1148-BBGA (FCBGA) package with supplier designation 1148-FCPBGA (35×35) optimized for high-pin-count system layouts and surface-mount assembly.
- Power Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulators.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Compliance RoHS compliant for regulatory environmental requirements.
Typical Applications
- High-performance digital signal processing Leverages large logic capacity and approximately 5.3 Mbits of embedded memory for custom DSP, filtering, and data-path acceleration.
- Communications and networking High I/O count enables multi-channel interfaces, packet processing, and protocol implementation for networking equipment and telecom endpoints.
- Hardware prototyping and system integration Substantial logic resources and on-chip RAM support prototyping of complex SoC functions and hardware acceleration blocks.
- Instrumentation and test equipment Large logic and I/O resources allow implementation of custom measurement, control, and data acquisition logic.
Unique Advantages
- High logic density: 152,064 logic elements provide headroom for complex designs and multi-function implementations without immediate partitioning across devices.
- Significant embedded memory: Approximately 5.3 Mbits of on-chip RAM reduces external memory dependence and simplifies board-level memory design.
- Extensive I/O connectivity: 768 I/O pins support broad peripheral connectivity and high-bandwidth parallel interfaces.
- Compact high-pin-count package: 1148-ball FCBGA (supplier 1148-FCPBGA (35×35)) enables dense system layouts while retaining high interconnect capacity.
- Commercial-grade operating range: Rated 0 °C to 85 °C for general-purpose embedded and industrial-adjacent applications.
- RoHS compliant: Meets environmental regulatory requirements for lead-free assembly and disposal.
Why Choose XC4VLX160-10FF1148C?
The XC4VLX160-10FF1148C positions itself as a robust, high-capacity FPGA choice for engineers building complex digital systems that require large amounts of logic, substantial embedded RAM, and abundant I/O. Its ball-grid package and surface-mount mounting type support compact board designs while providing extensive interconnect options.
This device is well suited to teams developing advanced DSP, communications, prototyping, and instrumentation solutions that benefit from integrated memory and high logic density. With commercial-grade temperature ratings and RoHS compliance, it delivers a combination of performance and regulatory readiness for a wide range of embedded applications.
Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC4VLX160-10FF1148C.

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