XC4VLX15-11SFG363I

The XC4VLX15-11SFG363I is a Virtex‑4 LX family field programmable gate array provided in a 363‑FBGA package. It offers a balanced combination of programmable logic capacity, embedded RAM, and I/O count targeted at industrial applications that require flexible hardware implementation and reliability across a wide temperature range.

With 13,824 logic elements, approximately 0.885 Mbits of embedded memory and 240 user I/O, this device is suited for designs that need substantial on‑chip resources in a compact surface‑mount FCBGA package while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Core Logic — 13,824 logic elements provide significant programmable fabric for implementing custom digital logic, state machines and control functions.
• Embedded Memory — Approximately 0.885 Mbits of on‑chip RAM for buffering, FIFOs and small on‑device data storage without external memory.
• I/O Capacity — 240 user I/O pins to support multiple interfaces, peripherals and board-level connectivity needs.
• Package and Mounting — 363‑FBGA (363‑FCBGA, 17×17) surface‑mount package that offers a compact footprint for high-density board designs.
• Power — Core supply range of 1.14 V to 1.26 V to match system power budgets and regulator designs.
• Temperature Range — Industrial operating range from ‑40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control logic, I/O aggregation, or custom control algorithms using the device’s logic capacity and robust temperature rating.
• Embedded Systems — Integrate peripheral interfacing, protocol bridging, and custom data paths with abundant I/O and on‑chip memory.
• Signal Conditioning and Processing — Use the programmable fabric and embedded RAM for buffering, preprocessing, and deterministic pipeline tasks.

Unique Advantages

• Significant On‑Chip Logic: 13,824 logic elements enable complex designs without immediately resorting to external processors or co‑processors.
• Integrated Memory: Approximately 0.885 Mbits of embedded RAM reduces dependence on external memory for control and buffering functions, simplifying board design.
• High I/O Density: 240 user I/O pins support multiple peripherals and interfaces, minimizing the need for external multiplexing components.
• Industrial Temperature Rating: Specified operation from ‑40 °C to 100 °C supports deployment in demanding environmental conditions common in industrial systems.
• Compact FCBGA Packaging: The 363‑FBGA (17×17) surface‑mount package provides a high‑density solution for space‑constrained PCBs.
• RoHS Compliance: Meets environmental requirements for lead‑free manufacturing processes.

Why Choose XC4VLX15-11SFG363I?

The XC4VLX15-11SFG363I positions itself as a versatile, industrial‑grade FPGA option that combines substantial programmable logic, embedded RAM and a large I/O complement in a compact 363‑FBGA package. Its voltage and temperature specifications make it suitable for systems that require reliable operation across standard industrial power and thermal environments.

This device is well suited for engineers and procurement teams developing industrial control, embedded processing and signal‑conditioning applications that benefit from on‑device integration, reduced external BOM, and long‑term deployment stability.

Request a quote or submit an inquiry for pricing and availability to begin integrating the XC4VLX15-11SFG363I into your next design.