XC4VLX15-11SFG363C

IC FPGA 240 I/O 363FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 884736 13824 363-FBGA, FCBGA

Quantity 838 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package363-FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case363-FBGA, FCBGANumber of I/O240Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells13824
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits884736

Overview of XC4VLX15-11SFG363C – Virtex®-4 LX Field Programmable Gate Array, 363-FBGA

The XC4VLX15-11SFG363C is a Virtex®-4 LX field programmable gate array in a 363-FBGA surface-mount package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for commercial-grade designs.

With 1,536 configurable logic blocks (CLBs), 13,824 logic elements and approximately 0.885 Mbits of on-chip RAM, this device is suited for applications that require moderate programmable logic, substantial on-chip memory, and a 240-pin I/O interface within a compact FCBGA footprint.

Key Features

  • Core Logic 1,536 CLBs totaling 13,824 logic elements for implementating custom logic and control functions.
  • Embedded Memory Approximately 0.885 Mbits of on-chip RAM (884,736 bits) for buffering, frame storage, and local data processing.
  • I/O Capacity 240 user I/O pins to support multiple interfaces and parallel connectivity requirements.
  • Package & Mounting 363-FBGA (17 × 17 mm) FCBGA package, designed for surface-mount assembly in space-constrained boards.
  • Power Specified core voltage range of 1.14 V to 1.26 V to guide power-supply design and sequencing.
  • Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant to meet common regulatory requirements for lead-free assembly.

Unique Advantages

  • Flexible logic capacity: 1,536 CLBs and 13,824 logic elements provide a clear balance of programmable resources for control, data-path, and glue-logic implementations.
  • On-chip memory for local buffering: Nearly 0.885 Mbits of embedded RAM reduces reliance on external memory for many intermediate storage tasks.
  • High I/O density: 240 I/Os enable multiple parallel interfaces and extensive external connectivity without large package trade-offs.
  • Compact BGA footprint: The 363-FCBGA (17 × 17 mm) package supports high-density board layouts and surface-mount manufacturing.
  • Predictable power envelope: A defined supply range (1.14–1.26 V) simplifies power-supply selection and thermal planning.
  • Commercial readiness and compliance: Commercial-grade temperature rating and RoHS compliance support mainstream product development and manufacturing.

Why Choose XC4VLX15-11SFG363C?

The XC4VLX15-11SFG363C positions itself as a capable Virtex-4 LX FPGA option when you need a balanced mix of logic resources, embedded memory and I/O in a compact FCBGA package. Its combination of 1,536 CLBs, 13,824 logic elements, approximately 0.885 Mbits of on-chip RAM and 240 I/Os makes it suitable for commercial designs that require moderate programmable logic and local memory without sacrificing board density.

Backed by AMD manufacturing and delivered in a RoHS-compliant, surface-mount 363-FCBGA package, this device supports standard commercial temperature operation and offers clear electrical and mechanical parameters to streamline system integration and procurement decisions.

Request a quote or submit an inquiry for XC4VLX15-11SFG363C to check availability, lead times and pricing for your next design.

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