XC4VLX160-10FFG1148I

IC FPGA 768 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 5308416 152064 1148-BBGA, FCBGA

Quantity 985 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O768Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16896Number of Logic Elements/Cells152064
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5308416

Overview of XC4VLX160-10FFG1148I – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 152,064 Logic Elements, 768 I/O

The XC4VLX160-10FFG1148I is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD. It provides a large logic fabric, substantial on-chip memory, and a high I/O count in a 1148-BBGA FCBGA package targeted at industrial-grade applications.

This device is suited to designs that require dense programmable logic, significant embedded RAM, and a high number of external I/O connections while operating across an industrial temperature range.

Key Features

  • Logic Capacity  Contains 16,896 CLBs and 152,064 logic elements (cells) for implementing complex, high-density digital logic.
  • Embedded Memory  Approximately 5.3 Mbits of on-chip RAM (5,308,416 bits) to support data buffering, state storage, and local memory requirements.
  • High I/O Count  768 I/O pins provide extensive external connectivity for parallel interfaces, buses, and system-level integration.
  • Power Supply  Specified core voltage range of 1.14 V to 1.26 V to match platform power requirements.
  • Package and Mounting  1148-BBGA (1148-FCPBGA, 35×35) FCBGA package with surface-mount mounting type for compact board-level integration.
  • Industrial Grade and Temperature Range  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant for environmentally conscious designs.

Typical Applications

  • High-density digital processing  Deploy the device where large programmable logic capacity and embedded memory are required to implement signal processing pipelines and custom datapaths.
  • Communication interfaces  Use the high I/O count to implement multiple parallel interfaces, protocol bridging, and packet processing functions.
  • Industrial control and automation  Industrial temperature rating and extensive I/O make the device suitable for control logic, sensor aggregation, and real-time decision systems.
  • Prototyping and system integration  Leverage the large logic and memory resources to prototype complex SoC functions and integrate multiple subsystems onto a single FPGA.

Unique Advantages

  • Large on-chip logic fabric: 152,064 logic elements and 16,896 CLBs enable consolidation of complex designs into a single device, reducing board-level component count.
  • Substantial embedded memory: Approximately 5.3 Mbits of RAM supports buffering and local data storage, minimizing external memory dependency.
  • Extensive external connectivity: 768 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and dense system interconnects.
  • Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in an industrial-grade package for use in demanding environments.
  • Compact package footprint: 1148-FCPBGA (35×35) package supports high-density board layouts while offering a high pin count.
  • Regulatory compliance: RoHS compliance supports environmentally responsible product designs.

Why Choose XC4VLX160-10FFG1148I?

The XC4VLX160-10FFG1148I combines a high-capacity logic fabric, significant on-chip RAM, and a large complement of I/O in an industrial-grade FCBGA package. These characteristics position the device for designs that require consolidation of complex digital functions, local memory resources, and wide external connectivity while maintaining operation across a broad temperature range.

This part is well suited for engineering teams building high-density processing, communication, and industrial control systems that value integration and robustness. Its combination of logic, memory, I/O, and industrial operating range offers long-term design flexibility for scalable and reliable implementations.

Request a quote or contact sales to discuss availability, lead times, and pricing for the XC4VLX160-10FFG1148I.

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