XC4VLX160-10FFG1148I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 5308416 152064 1148-BBGA, FCBGA |
|---|---|
| Quantity | 985 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16896 | Number of Logic Elements/Cells | 152064 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5308416 |
Overview of XC4VLX160-10FFG1148I – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 152,064 Logic Elements, 768 I/O
The XC4VLX160-10FFG1148I is a Virtex®-4 LX field programmable gate array (FPGA) IC from AMD. It provides a large logic fabric, substantial on-chip memory, and a high I/O count in a 1148-BBGA FCBGA package targeted at industrial-grade applications.
This device is suited to designs that require dense programmable logic, significant embedded RAM, and a high number of external I/O connections while operating across an industrial temperature range.
Key Features
- Logic Capacity Contains 16,896 CLBs and 152,064 logic elements (cells) for implementing complex, high-density digital logic.
- Embedded Memory Approximately 5.3 Mbits of on-chip RAM (5,308,416 bits) to support data buffering, state storage, and local memory requirements.
- High I/O Count 768 I/O pins provide extensive external connectivity for parallel interfaces, buses, and system-level integration.
- Power Supply Specified core voltage range of 1.14 V to 1.26 V to match platform power requirements.
- Package and Mounting 1148-BBGA (1148-FCPBGA, 35×35) FCBGA package with surface-mount mounting type for compact board-level integration.
- Industrial Grade and Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
- Compliance RoHS compliant for environmentally conscious designs.
Typical Applications
- High-density digital processing Deploy the device where large programmable logic capacity and embedded memory are required to implement signal processing pipelines and custom datapaths.
- Communication interfaces Use the high I/O count to implement multiple parallel interfaces, protocol bridging, and packet processing functions.
- Industrial control and automation Industrial temperature rating and extensive I/O make the device suitable for control logic, sensor aggregation, and real-time decision systems.
- Prototyping and system integration Leverage the large logic and memory resources to prototype complex SoC functions and integrate multiple subsystems onto a single FPGA.
Unique Advantages
- Large on-chip logic fabric: 152,064 logic elements and 16,896 CLBs enable consolidation of complex designs into a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 5.3 Mbits of RAM supports buffering and local data storage, minimizing external memory dependency.
- Extensive external connectivity: 768 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and dense system interconnects.
- Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in an industrial-grade package for use in demanding environments.
- Compact package footprint: 1148-FCPBGA (35×35) package supports high-density board layouts while offering a high pin count.
- Regulatory compliance: RoHS compliance supports environmentally responsible product designs.
Why Choose XC4VLX160-10FFG1148I?
The XC4VLX160-10FFG1148I combines a high-capacity logic fabric, significant on-chip RAM, and a large complement of I/O in an industrial-grade FCBGA package. These characteristics position the device for designs that require consolidation of complex digital functions, local memory resources, and wide external connectivity while maintaining operation across a broad temperature range.
This part is well suited for engineering teams building high-density processing, communication, and industrial control systems that value integration and robustness. Its combination of logic, memory, I/O, and industrial operating range offers long-term design flexibility for scalable and reliable implementations.
Request a quote or contact sales to discuss availability, lead times, and pricing for the XC4VLX160-10FFG1148I.

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