XC4VLX160-10FFG1513C

The XC4VLX160-10FFG1513C is a Virtex®-4 LX field programmable gate array (FPGA) manufactured by AMD. It provides a large logic fabric combined with embedded memory and a high count of I/O to support complex, I/O‑rich digital designs in commercial-temperature applications. Key on‑chip resources and a compact 1513‑FCBGA package make it suitable for designs that require significant logic capacity and extensive external connectivity.

Key Features

• Logic Capacity — 152,064 logic elements and 16,896 configurable logic blocks (CLBs) for implementing large digital functions and complex custom logic.
• Embedded Memory — Approximately 5.31 Mbits of on‑chip RAM to support buffering, lookup tables, and intermediate data storage within the FPGA fabric.
• I/O Density — 960 I/O pins to enable connectivity with multiple peripherals, high‑pin-count interfaces, and system expansion.
• Package — 1513‑BBGA (1513‑FCBGA, 40×40) surface-mount package for compact board integration and reliable solder mounting.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting lead‑free manufacturing requirements.

Typical Applications

• I/O‑intensive systems — With 960 I/O, suitable for designs requiring broad external connectivity and multiple parallel interfaces.
• Large digital processing — The combination of 152,064 logic elements and approximately 5.31 Mbits of embedded memory supports complex state machines, parallel processing, and custom datapaths.
• Compact, high‑density boards — The 1513‑FCBGA (40×40) surface‑mount package enables integration into space‑constrained commercial products.

Unique Advantages

• Substantial logic resources: 152,064 logic elements provide the capacity to implement large-scale logic functions without external ASICs or CPLDs.
• Significant on‑chip memory: Approximately 5.31 Mbits of embedded RAM reduces reliance on external memory for intermediate storage, lowering BOM complexity.
• High I/O count: 960 I/O pins simplify system-level integration with sensors, peripherals, and multi‑channel interfaces.
• Compact FCBGA packaging: 1513‑FCBGA (40×40) enables dense board layouts while maintaining a surface‑mount form factor for automated assembly.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product environments and lead‑free manufacturing flows.

Why Choose XC4VLX160-10FFG1513C?

The XC4VLX160-10FFG1513C positions itself as a high‑capacity Virtex®‑4 LX FPGA option for commercial designs that require extensive logic, embedded memory, and a large number of I/O in a compact FCBGA package. Its combination of 152,064 logic elements, approximately 5.31 Mbits of on‑chip RAM, and 960 I/O makes it well suited for advanced digital implementations where integration density and connectivity are priorities.

Designed and manufactured by AMD, this device supports surface‑mount assembly and RoHS‑compliant production for mainstream commercial applications operating between 0 °C and 85 °C, with a core supply range of 1.14 V to 1.26 V to match system power requirements.

Request a quote or submit an inquiry to check pricing and availability for the XC4VLX160-10FFG1513C and to discuss how its logic capacity, memory, and I/O can meet your project requirements.