XC4VLX160-11FF1148C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 768 5308416 152064 1148-BBGA, FCBGA |
|---|---|
| Quantity | 152 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 768 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16896 | Number of Logic Elements/Cells | 152064 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5308416 |
Overview of XC4VLX160-11FF1148C – Virtex®-4 LX FPGA, 152,064 logic elements
The XC4VLX160-11FF1148C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC from AMD, provided in an 1148-BBGA FCBGA package. It offers a high count of logic elements, substantial on-chip memory, and a large number of user I/O to support complex, high-density digital designs in commercial applications.
Key attributes include 152,064 logic elements, approximately 5.3 Mbits of embedded memory, and 768 general-purpose I/Os, combined with a 1.14 V–1.26 V core supply range and a commercial operating temperature of 0 °C to 85 °C.
Key Features
- Core Logic 152,064 logic elements for implementing large, complex custom logic and parallel processing structures.
- Embedded Memory Approximately 5.3 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- I/O Capacity 768 user I/Os to accommodate wide external interfaces, extensive peripheral connectivity, and multi-channel designs.
- Power Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
- Package and Mounting 1148-BBGA (FCBGA) package; supplier device package listed as 1148-FCPBGA (35×35). Designed for surface-mount assembly.
- Temperature and Grade Commercial grade operation with an ambient range of 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 152,064 logic elements provide the resources needed for sizable, feature-rich FPGA implementations.
- Substantial embedded memory: Approximately 5.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT needs.
- Extensive I/O count: 768 I/Os simplify connectivity for multi-channel designs and complex peripheral interfaces.
- Compact FCBGA footprint: 1148-BBGA / 1148-FCPBGA (35×35) packaging enables a high-density implementation in surface-mount assemblies.
- Commercial temperature suitability: Specified operation from 0 °C to 85 °C for general-purpose commercial deployments.
- Vendor pedigree: Manufactured by AMD, offering a recognized FPGA platform for commercial designs.
Why Choose XC4VLX160-11FF1148C?
The XC4VLX160-11FF1148C is positioned for commercial designs that demand large programmable logic capacity, a significant amount of embedded RAM, and a high number of I/O signals in a compact surface-mount BGA package. Its combination of 152,064 logic elements, approximately 5.3 Mbits of on-chip memory, and 768 I/Os delivers the raw resources needed for complex digital systems while remaining within standard commercial temperature and power envelopes.
Choose this FPGA when your design requires dense logic implementation, substantial local memory, and broad external connectivity in a single-package solution from a known FPGA manufacturer.
Request a quote or submit an inquiry to obtain pricing and availability for the XC4VLX160-11FF1148C.

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