XC4VLX200-10FFG1513I

The XC4VLX200-10FFG1513I is a Virtex-4 LX series Field Programmable Gate Array (FPGA) from AMD supplied in a 1513-ball FCBGA package. It delivers large on-chip logic and memory resources together with a high I/O count, and is offered in an industrial-grade temperature range for demanding embedded applications.

With 200,448 logic elements, approximately 6.19 Mbits of embedded memory and 960 I/O pins, this device targets complex digital designs that require significant logic capacity, substantial on-chip RAM and extensive external interfacing, while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Core Logic 200,448 logic elements provide a large implementation space for complex algorithms, state machines and custom hardware accelerators.
• Embedded Memory Approximately 6.19 Mbits of on-chip RAM enables local buffering, look-up tables and data storage without immediate reliance on external memory.
• I/O Capacity 960 programmable I/O pins support extensive external connectivity for parallel buses, multi-channel interfaces and wide data paths.
• Power Core voltage supply range of 1.14 V to 1.26 V, allowing designers to plan power delivery and thermal budgets around a defined operating window.
• Package 1513-ball BGA (1513-FCBGA, 40×40) surface-mount package suitable for high-density PCB assembly.
• Temperature Range Industrial operating temperature from −40°C to 100°C for deployment in controlled and harsh environments.
• Compliance RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• Communications Infrastructure Implement multi-channel data processing, protocol offload and interface bridging with the device’s large logic and I/O resources.
• Industrial Control Use for motor control, PLC logic and real-time control systems where on-chip memory and industrial temperature rating are important.
• Video and Imaging Processing Support wide parallel data paths and local buffering for image pipelines and video preprocessing functions.
• High-density Prototyping and ASIC Emulation Leverage the large logic capacity to prototype complex SoC functions or emulate hardware behavior prior to ASIC development.

Unique Advantages

• Substantial Logic Capacity: 200,448 logic elements let designers integrate large, multi-function systems on a single device, reducing external component count.
• Significant On-chip Memory: Approximately 6.19 Mbits of embedded RAM provide local storage for buffering, tables and state, lowering dependence on external DRAM.
• Extensive I/O Availability: 960 I/O pins enable broad interfacing options for high-throughput and multi-peripheral designs.
• Industrial-grade Reliability: Rated for −40°C to 100°C operation, suitable for industrial applications that require extended temperature endurance.
• Compact High-density Package: The 1513-FCBGA (40×40) package supports high-pin-count designs while minimizing PCB area.
• RoHS Compliance: Meets lead-free assembly requirements for modern electronic manufacturing.

Why Choose XC4VLX200-10FFG1513I?

The XC4VLX200-10FFG1513I positions itself as a high-capacity Virtex-4 LX FPGA option for designs that demand large logic resources, substantial embedded memory and extensive external connectivity in an industrial-grade package. It is well suited to system-level integration where consolidation of functionality onto a single FPGA can simplify board design and reduce bill-of-materials complexity.

Engineers and procurement teams looking for a robust, high-density FPGA with a defined core voltage window, broad I/O capability and a BGA surface-mount package will find this device aligns with long-term project needs while meeting environmental compliance expectations.

Request a quote or submit a purchase inquiry to obtain pricing, availability and lead-time information for the XC4VLX200-10FFG1513I.