XC4VLX200-11FF1513C
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 960 6193152 200448 1513-BBGA, FCBGA |
|---|---|
| Quantity | 1,399 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1513-FCBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1513-BBGA, FCBGA | Number of I/O | 960 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 22272 | Number of Logic Elements/Cells | 200448 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6193152 |
Overview of XC4VLX200-11FF1513C – Virtex®-4 LX FPGA, 1513-FCBGA (40×40)
The XC4VLX200-11FF1513C is a Virtex-4 LX field programmable gate array (FPGA) IC from AMD. It provides a high-density programmable logic fabric with a large count of configurable logic blocks and a substantial on-chip memory complement for implementing complex digital functions.
Packaged in a 1513-FCBGA (1513-BBGA) surface-mount package and specified for commercial temperature operation, the device delivers a combination of logic capacity, I/O density and on-chip RAM suited to designs that require large-scale programmable logic in a single-chip solution.
Key Features
- Core Logic 22,272 configurable logic blocks (CLBs) delivering 200,448 logic elements for implementing complex digital designs.
- Embedded Memory Approximately 6.19 Mbits of on-chip RAM for local data buffering, FIFOs and state storage.
- I/O Density 960 user I/O pins to support wide parallel interfaces and dense external connectivity.
- Power Core supply voltage range of 1.14 V to 1.26 V for the FPGA core power rail.
- Package & Mounting 1513-FCBGA (1513-BBGA) package, listed as 40×40, designed for surface-mount PCB assembly.
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-density digital systems Use the large pool of logic elements and 960 I/O to consolidate multiple digital functions into a single FPGA package.
- Memory-intensive logic Embedded RAM (approximately 6.19 Mbits) enables local buffering, data manipulation and protocol FIFOs.
- Prototyping and development High logic capacity and abundant I/O facilitate hardware prototyping and verification of complex designs.
- Communication and interface aggregation Dense I/O count supports aggregation and bridging of multiple parallel interfaces.
Unique Advantages
- Large programmable fabric: 200,448 logic elements and 22,272 CLBs give designers capacity to implement complex, multi-function logic on a single device.
- Substantial on-chip RAM: Approximately 6.19 Mbits of embedded memory reduces dependence on external memory for intermediate storage and buffering.
- High I/O count: 960 user I/Os enable wide parallel interfaces and flexible pinout options for dense system integration.
- Compact surface-mount package: 1513-FCBGA (1513-BBGA) package allows integration into compact PCB layouts while maintaining thermal and electrical connectivity.
- Commercial temperature rating: Standard 0 °C to 85 °C operating range for applications and systems specified for commercial environments.
- Regulatory compliance: RoHS compliance supports designs targeting lead-free assembly processes.
Why Choose XC4VLX200-11FF1513C?
The XC4VLX200-11FF1513C positions itself as a high-capacity Virtex-4 LX FPGA from AMD, delivering a balance of large logic resources, significant embedded RAM and very high I/O density in a single surface-mount FCBGA package. It is well suited to designs that require consolidation of multiple functions, substantial on-chip buffering and broad interface connectivity within commercial temperature environments.
As an AMD-manufactured Virtex-4 device with available manufacturer documentation, the XC4VLX200-11FF1513C provides a documented, high-density programmable building block for engineers and procurement teams seeking a scalable FPGA option backed by vendor datasheet resources.
Request a quote or submit an inquiry for pricing and availability of the XC4VLX200-11FF1513C to receive lead-time and ordering details.

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