XC5VFX200T-1FFG1738I

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 960 16809984 196608 1738-BBGA, FCBGA

Quantity 468 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15360Number of Logic Elements/Cells196608
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits16809984

Overview of XC5VFX200T-1FFG1738I – Virtex®-5 FXT Field Programmable Gate Array (FPGA), 1738-FCBGA

The XC5VFX200T-1FFG1738I is a high-density Field Programmable Gate Array (FPGA) IC from AMD's Virtex®-5 FXT family. It combines a large logic capacity with substantial on-chip memory and extensive I/O to address designs that require significant programmable logic, embedded RAM and broad connectivity.

With 196,608 logic elements, approximately 16.8 Mbits of embedded memory and up to 960 I/O pins, this surface-mount FCBGA device targets applications that demand dense integration, high channel counts and operation across an industrial temperature range.

Key Features

  • High Logic Capacity 196,608 logic elements provide a large fabric for implementing complex digital logic and custom hardware functions.
  • Embedded Memory Approximately 16.8 Mbits of on-chip RAM for buffering, lookup tables and local storage without external memory dependency.
  • Extensive I/O Up to 960 I/O pins to support high pin-count interfaces, multi-channel systems and dense connectivity requirements.
  • Core Voltage Range Operates with a core supply from 0.95 V to 1.05 V, enabling defined power domain planning and stable core operation.
  • Package & Mounting 1738-FCBGA package (42.5 × 42.5 mm), surface-mount mounting for compact, board-level integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for environments requiring extended temperature capability.
  • RoHS Compliant Meets RoHS environmental requirements.

Typical Applications

  • High-density signal processing — Large logic capacity and significant on-chip RAM enable implementation of complex, parallel processing pipelines and data buffering.
  • Networking and communications — High I/O count supports multi-channel interfaces and complex board-level interconnects.
  • Industrial control and automation — Industrial temperature rating and robust package make the device suitable for demanding control environments.
  • Custom hardware acceleration and prototyping — Large programmable fabric and memory enable hardware acceleration functions and advanced prototyping workflows.

Unique Advantages

  • High compute density: 196,608 logic elements let designers implement large-scale custom logic on a single device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 16.8 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
  • Broad connectivity: Up to 960 I/O pins accommodate high-channel-count interfaces and extensive peripheral integration.
  • Industrial temperature capability: −40 °C to 100 °C operation supports deployments in temperature-challenging environments.
  • Compact FCBGA package: The 1738-FCBGA (42.5 × 42.5 mm) surface-mount package enables dense board layouts while maintaining thermal and mechanical stability.
  • Defined core power domain: 0.95–1.05 V supply range provides predictable core power planning for system designers.

Why Choose XC5VFX200T-1FFG1738I?

The XC5VFX200T-1FFG1738I positions itself as a solution for designs that require a combination of large programmable logic capacity, significant on-chip memory and extensive I/O in a surface-mount FCBGA package. Its industrial temperature rating and RoHS compliance add to its suitability for long-life and environmentally regulated deployments.

Engineers and product teams seeking a scalable, high-density FPGA platform will find this device useful for consolidating complex functions, reducing external component count and enabling flexible hardware architectures driven by programmable logic.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XC5VFX200T-1FFG1738I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up