XC5VFX200T-1FF1738CES

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 960 16809984 196608 1738-BBGA, FCBGA

Quantity 1,290 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15360Number of Logic Elements/Cells196608
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits16809984

Overview of XC5VFX200T-1FF1738CES – Virtex®-5 FXT FPGA, 1738-FCBGA

The XC5VFX200T-1FF1738CES is a Virtex®-5 FXT field-programmable gate array (FPGA) in a 1738-ball FCBGA package. It delivers very large logic capacity and on-chip memory with a high I/O count, aimed at commercial designs that require substantial programmable logic and embedded memory resources.

Key native attributes include 196,608 logic elements, approximately 16.8 Mbits of embedded RAM, and 960 I/O pins, providing a platform for high-density logic integration while operating within a commercial temperature range.

Key Features

  • Logic Capacity  196,608 logic elements for implementing large-scale logic, control and glue logic functions.
  • Configurable Logic Blocks (CLBs)  High CLB count supports complex logic synthesis and partitioning for advanced designs.
  • Embedded Memory  Approximately 16.8 Mbits of on-chip RAM to support buffering, frame memory, and algorithmic state storage without external RAM.
  • I/O Density  960 I/O pins to accommodate wide parallel interfaces, multiple buses and high port-count designs.
  • Power Supply  Core voltage range from 950 mV to 1.05 V, enabling precise power delivery for the FPGA core.
  • Package & Mounting  1738-ball FCBGA (1738-BBGA) surface-mount package; supplier device package specified as 1738-FCBGA (42.5 × 42.5 mm) for high-density board integration.
  • Operating Conditions  Commercial-grade operation from 0 °C to 85 °C suitable for standard commercial applications.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-density logic systems  Implement large programmable logic networks and custom accelerators using the extensive logic element count.
  • Memory-intensive designs  Use the on-chip RAM for frame buffering, data path storage and intermediate algorithm state without relying solely on external memory.
  • High I/O integration  Integrate numerous peripheral interfaces, parallel buses or multi‑lane connections enabled by 960 I/O pins.
  • Commercial embedded platforms  Deploy in commercial-temperature embedded systems that require scalable logic and memory capacity.

Unique Advantages

  • Substantial logic resources: 196,608 logic elements allow consolidation of multiple functions into a single device, reducing system BOM and board complexity.
  • Integrated memory capacity: Approximately 16.8 Mbits of embedded RAM supports large on-chip data structures and reduces external memory dependency.
  • Very high I/O count: 960 I/Os simplify routing of wide interfaces and multiple peripherals without extensive external multiplexing.
  • Compact, surface-mount packaging: The 1738-FCBGA (42.5 × 42.5 mm) package provides a dense footprint for high-performance boards while maintaining manufacturability.
  • Commercial temperature rating: Rated 0 °C to 85 °C for use in standard commercial environments, aligning with many commercial embedded product requirements.
  • RoHS compliant: Suitable for environments and supply chains that require compliance with RoHS directives.

Why Choose XC5VFX200T-1FF1738CES?

The XC5VFX200T-1FF1738CES positions itself as a high-capacity, high-I/O FPGA for commercial designs that need extensive programmable logic and embedded memory in a single, surface-mount FCBGA package. Its combination of nearly 200k logic elements, substantial on-chip RAM, and 960 I/Os makes it well suited for consolidating complex functions, supporting large data paths and integrating numerous interfaces.

For teams designing commercial embedded systems that require scalability and integration, this device offers a robust hardware foundation that reduces external component count and supports dense board implementations while operating within standard commercial temperature and power ranges.

Request a quote or submit a parts inquiry to get pricing and availability for XC5VFX200T-1FF1738CES. Our team can provide lead-time and ordering support for your project requirements.

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