XC5VFX130T-2FFG1738C
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 840 10985472 131072 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,524 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 840 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10240 | Number of Logic Elements/Cells | 131072 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10985472 |
Overview of XC5VFX130T-2FFG1738C – Virtex®-5 FXT Field Programmable Gate Array (1738-FCBGA)
The XC5VFX130T-2FFG1738C is a Virtex®-5 FXT field programmable gate array (FPGA) from AMD supplied in a 1738-FCBGA package. It provides a large programmable fabric with high I/O density and substantial on-chip memory for commercial embedded and systems applications.
Key attributes include 131,072 logic elements, approximately 11 Mbits of embedded memory, and 840 user I/Os, with a core supply range of 0.95 V to 1.05 V and an operating temperature of 0 °C to 85 °C.
Key Features
- Programmable Fabric 131,072 logic elements and 10,240 configurable logic blocks (CLBs) provide extensive capacity for complex logic implementation and custom hardware acceleration.
- Embedded Memory Approximately 11 Mbits of on-chip RAM to support buffering, data processing, and storage-intensive functions without immediate external memory dependence.
- High I/O Count 840 user I/Os for broad interface support and dense board-level connectivity.
- Power and Voltage Core voltage specified from 0.95 V to 1.05 V to match system power rails and design constraints.
- Package and Mounting Supplied in a 1738-FCBGA footprint (42.5×42.5 mm) with surface-mount assembly for compact board integration.
- Commercial Grade Rated for operation from 0 °C to 85 °C and intended for commercial applications.
- RoHS Compliant Conforms to RoHS requirements for restricted substances.
Typical Applications
- Commercial Embedded Systems — Implements custom logic and acceleration functions in commercial embedded products that require large logic and memory resources.
- Interface and I/O Bridging — High I/O count enables complex protocol interfacing, signal aggregation, and board-level bridging tasks.
- Data Buffering and Processing — On-chip memory and abundant logic elements support in-line data manipulation, buffering, and real-time processing.
- Prototyping and Platform Development — Large programmable resources make the device suitable for developing and validating complex digital designs.
Unique Advantages
- Large Logic Capacity: 131,072 logic elements and 10,240 CLBs provide the headroom needed for complex algorithms and multi-function designs.
- Substantial Embedded Memory: Approximately 11 Mbits of on-chip RAM reduces external memory dependency and simplifies board design.
- Extensive I/O Resources: 840 user I/Os enable dense connectivity for multi-protocol systems and rich peripheral interfacing.
- Compact FCBGA Package: 1738-FCBGA (42.5×42.5 mm) allows integration into space-constrained commercial boards with surface-mount assembly.
- Commercial Temperature Range: Qualified for 0 °C to 85 °C operation to match commercial product environments.
- Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for commercial products.
Why Choose XC5VFX130T-2FFG1738C?
The XC5VFX130T-2FFG1738C positions itself as a high-capacity FPGA option for commercial designs that demand large programmable logic, abundant embedded memory, and a high number of I/Os. Its FCBGA package and surface-mount form factor allow integration into compact boards while maintaining significant on-chip resources.
This device is suited to customers building commercial embedded systems, platform prototypes, or interface-rich applications that benefit from programmable hardware capacity and the integration advantages of on-chip memory and high I/O density.
Request a quote or submit an inquiry to receive pricing and availability information for the XC5VFX130T-2FFG1738C.

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