XC5VFX130T-1FFG1738C
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 840 10985472 131072 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,129 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 840 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10240 | Number of Logic Elements/Cells | 131072 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10985472 |
Overview of XC5VFX130T-1FFG1738C – Virtex®-5 FXT Field Programmable Gate Array (FPGA)
The XC5VFX130T-1FFG1738C is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1738-FCBGA package. It delivers substantial on-chip resources suitable for complex, high-density digital designs.
With 131,072 logic elements, approximately 11 Mbits of embedded memory, and 840 I/O pins, this commercial-grade, surface-mount FPGA supports designs that require large logic capacity, significant embedded memory, and extensive external connectivity while operating from a 0.95 V–1.05 V core supply and within a 0 °C to 85 °C temperature range.
Key Features
- Core Architecture Virtex-5 FXT FPGA family device from AMD in a 1738-FCBGA supplier package (42.5 × 42.5 mm).
- Logic Capacity 131,072 logic elements to implement wide-ranging combinational and sequential logic functions.
- Embedded Memory Approximately 11 Mbits of on-chip RAM for buffering, packet storage, or algorithm acceleration.
- I/O Density 840 I/O pins to support large parallel interfaces and multiple external subsystems.
- Power and Supply Core voltage range 950 mV to 1.05 V to match system power rails and design requirements.
- Package and Mounting 1738-BBGA / 1738-FCBGA package, surface-mount mounting suitable for standard PCB assembly workflows.
- Operating Range Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for environmental and manufacturing considerations.
Typical Applications
- High-density digital processing Implements large-scale custom logic and algorithm acceleration where substantial logic elements and embedded memory are required.
- Communication systems Provides the I/O capacity and on-chip RAM needed for packet buffering, protocol handling, and interface aggregation.
- Video and imaging Supports video pipelines and frame buffering using embedded memory and extensive parallel I/O connectivity.
- Prototyping and custom boards Enables complex FPGA-based prototypes and custom digital subsystems that require a high logic count and many external interfaces.
Unique Advantages
- Substantial logic resources: 131,072 logic elements enable implementation of large, multi-function designs without immediate need for multiple devices.
- Significant on-chip memory: Approximately 11 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage tasks.
- High I/O count: 840 I/Os simplify interfacing to a wide range of external components and parallel busses, lowering board-level complexity.
- Compact, standard package: 1738-FCBGA (42.5 × 42.5 mm) offers high integration in a package compatible with surface-mount assembly processes.
- Commercial temperature rating: Designed for 0 °C to 85 °C operation, matching typical commercial electronics system environments.
Why Choose XC5VFX130T-1FFG1738C?
The XC5VFX130T-1FFG1738C balances high logic capacity, abundant embedded memory, and extensive I/O in a single Virtex-5 FXT FPGA, making it suitable for complex digital designs that require integration and scalability. Its commercial-grade operating range and RoHS compliance align with standard manufacturing and deployment practices.
This device is appropriate for engineering teams developing high-density processing, communication, imaging, or prototype systems that benefit from a large FPGA resource pool, on-chip memory, and broad connectivity while maintaining common surface-mount assembly requirements.
Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC5VFX130T-1FFG1738C.

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