XC5VFX130T-1FFG1738C

IC FPGA 840 I/O 1738FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 840 10985472 131072 1738-BBGA, FCBGA

Quantity 1,129 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O840Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs10240Number of Logic Elements/Cells131072
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits10985472

Overview of XC5VFX130T-1FFG1738C – Virtex®-5 FXT Field Programmable Gate Array (FPGA)

The XC5VFX130T-1FFG1738C is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1738-FCBGA package. It delivers substantial on-chip resources suitable for complex, high-density digital designs.

With 131,072 logic elements, approximately 11 Mbits of embedded memory, and 840 I/O pins, this commercial-grade, surface-mount FPGA supports designs that require large logic capacity, significant embedded memory, and extensive external connectivity while operating from a 0.95 V–1.05 V core supply and within a 0 °C to 85 °C temperature range.

Key Features

  • Core Architecture  Virtex-5 FXT FPGA family device from AMD in a 1738-FCBGA supplier package (42.5 × 42.5 mm).
  • Logic Capacity  131,072 logic elements to implement wide-ranging combinational and sequential logic functions.
  • Embedded Memory  Approximately 11 Mbits of on-chip RAM for buffering, packet storage, or algorithm acceleration.
  • I/O Density  840 I/O pins to support large parallel interfaces and multiple external subsystems.
  • Power and Supply  Core voltage range 950 mV to 1.05 V to match system power rails and design requirements.
  • Package and Mounting  1738-BBGA / 1738-FCBGA package, surface-mount mounting suitable for standard PCB assembly workflows.
  • Operating Range  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • High-density digital processing  Implements large-scale custom logic and algorithm acceleration where substantial logic elements and embedded memory are required.
  • Communication systems  Provides the I/O capacity and on-chip RAM needed for packet buffering, protocol handling, and interface aggregation.
  • Video and imaging  Supports video pipelines and frame buffering using embedded memory and extensive parallel I/O connectivity.
  • Prototyping and custom boards  Enables complex FPGA-based prototypes and custom digital subsystems that require a high logic count and many external interfaces.

Unique Advantages

  • Substantial logic resources: 131,072 logic elements enable implementation of large, multi-function designs without immediate need for multiple devices.
  • Significant on-chip memory: Approximately 11 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage tasks.
  • High I/O count: 840 I/Os simplify interfacing to a wide range of external components and parallel busses, lowering board-level complexity.
  • Compact, standard package: 1738-FCBGA (42.5 × 42.5 mm) offers high integration in a package compatible with surface-mount assembly processes.
  • Commercial temperature rating: Designed for 0 °C to 85 °C operation, matching typical commercial electronics system environments.

Why Choose XC5VFX130T-1FFG1738C?

The XC5VFX130T-1FFG1738C balances high logic capacity, abundant embedded memory, and extensive I/O in a single Virtex-5 FXT FPGA, making it suitable for complex digital designs that require integration and scalability. Its commercial-grade operating range and RoHS compliance align with standard manufacturing and deployment practices.

This device is appropriate for engineering teams developing high-density processing, communication, imaging, or prototype systems that benefit from a large FPGA resource pool, on-chip memory, and broad connectivity while maintaining common surface-mount assembly requirements.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XC5VFX130T-1FFG1738C.

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