XC5VFX130T-1FF1738C

The XC5VFX130T-1FF1738C is a Virtex®-5 FXT family FPGA designed for commercial embedded designs that require substantial logic, memory, and I/O resources. Its architecture provides a large pool of programmable logic and on-chip memory suitable for complex, high-density implementations.

With 131,072 logic elements, approximately 11 Mbits of embedded memory, and 840 I/O pins in a 1738-ball FCBGA package, this device targets applications that demand high integration, dense I/O routing, and a compact surface-mount package footprint.

Key Features

• Logic Capacity  131,072 logic elements provide a large programmable fabric for complex digital designs and large-scale logic integration.
• Embedded Memory  Approximately 11 Mbits of on-chip RAM enables substantial data buffering, state storage, and tightly coupled memory for logic-intensive functions.
• I/O Density  840 general-purpose I/O pins support wide parallel interfaces and extensive connectivity to peripherals and external devices.
• Power Supply  Core voltage operation from 0.95 V to 1.05 V supports the device’s internal power requirements and system power budgeting.
• Package & Mounting  Available in a 1738-ball FCBGA (42.5 × 42.5 mm) surface-mount package that consolidates high pin-count connectivity in a compact form factor.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation, suitable for standard commercial embedded environments.
• Regulatory Compliance  RoHS compliant for alignment with lead-free assembly requirements.

Typical Applications

• Commercial Embedded Systems  Implement large custom logic blocks and on-chip memory for feature-rich consumer and enterprise equipment.
• High-Density I/O Platforms  Support systems that require many parallel interfaces or extensive peripheral connectivity with 840 available I/Os.
• Complex Programmable Logic Designs  Suitable for designs that need substantial logic element counts and embedded RAM for state machines, protocol engines, or glue logic.
• Prototyping and Evaluation  Use the device as a development platform when validating large-scale logic integration and memory usage before production deployment.

Unique Advantages

• High Logic Density:  131,072 logic elements enable integration of large functions on a single device, reducing the need for multiple FPGAs.
• Significant On-Chip Memory:  Approximately 11 Mbits of embedded RAM supports buffering and state retention directly within the FPGA fabric.
• Extensive I/O Count:  840 I/Os accommodate broad external connectivity without additional I/O expanders.
• Compact High-Pin-Count Package:  The 1738-ball FCBGA (42.5 × 42.5 mm) consolidates many signals in a space-efficient surface-mount form factor.
• Commercial Operating Range:  Rated 0 °C to 85 °C for use in standard commercial environments and applications.
• RoHS Compliant:  Designed for lead-free assembly and compliance with environmental standards.

Why Choose XC5VFX130T-1FF1738C?

The XC5VFX130T-1FF1738C combines a large logic fabric, substantial embedded memory, and a very high I/O count in a compact FCBGA package—making it a practical choice for commercial designs that require high integration and dense connectivity. Its specified core voltage range and RoHS compliance simplify system power planning and lead-free manufacturing.

This device is well suited to engineers and teams building complex programmable logic solutions, prototypes, or commercial products where on-chip resources and I/O density reduce board-level complexity and component count.

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