XC5VFX130T-2FF1738I

The XC5VFX130T-2FF1738I is a Virtex®-5 FXT field programmable gate array (FPGA) from AMD designed for high-capacity programmable logic and system integration. It provides a large number of logic elements and on‑chip memory along with a high I/O count, packaged in a 1738-ball flip-chip BGA (42.5 × 42.5 mm) suitable for surface-mount assembly.

Targeted for industrial applications, this device supports core voltages from 0.95 V to 1.05 V and operates across an extended temperature range of –40 °C to 100 °C, making it suitable for designs that require significant programmable logic, abundant I/O, and extended environmental tolerance.

Key Features

• Logic Capacity  Provides 131,072 logic elements for implementing large, complex digital designs and custom processing pipelines.
• Configurable Logic Blocks  Large fabric with 10,240 configurable logic blocks (CLBs) to structure logic hierarchies and modular design flows.
• Embedded Memory  Approximately 11 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density  840 I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count connectivity options.
• Package  1738-ball FCBGA (1738-BBGA) with a 42.5 × 42.5 mm footprint, optimized for surface-mount PCB assembly.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match system power requirements and regulator designs.
• Temperature and Grade  Industrial grade device rated for operation from –40 °C to 100 °C for extended-environment deployments.
• RoHS Compliance  RoHS-compliant construction for environmental and regulatory conformity.

Typical Applications

• Industrial Control Systems  Used where industrial-grade operation and extensive programmable logic are required for motor control, I/O aggregation, and real-time processing.
• Embedded Signal Processing  Suitable for designs that need substantial on‑chip RAM and logic resources for buffering and algorithm implementation.
• High‑Density I/O Systems  Well suited to applications requiring a large number of external interfaces or parallel data paths enabled by 840 I/O pins.

Unique Advantages

• Substantial Logic Resources: The 131,072 logic elements enable implementation of complex state machines, datapaths, and custom accelerators without partitioning across multiple devices.
• On‑Chip Memory Capacity: Approximately 11 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage, simplifying board design.
• High I/O Count: 840 I/O pins provide flexibility for interfacing to numerous peripherals, sensors, and buses in a single device.
• Industrial Temperature Range: Rated from –40 °C to 100 °C to meet environmental requirements for industrial and rugged applications.
• Compact FCBGA Package: The 1738-FCBGA (42.5 × 42.5 mm) package delivers high integration density in a surface-mount form factor for space-constrained layouts.
• Controlled Core Voltage: A defined supply range of 0.95 V to 1.05 V helps align power delivery design and regulator selection.

Why Choose XC5VFX130T-2FF1738I?

The XC5VFX130T-2FF1738I balances large programmable logic capacity, substantial embedded memory, and a very high I/O count in an industrial-grade FPGA package. Its specifications make it appropriate for designers who need to consolidate complex digital functions, on‑chip data storage, and extensive interfacing into a single device while meeting extended temperature requirements.

This part is suited to system-level designs that prioritize integration and scalability, offering a clear specification set for power, thermal, and I/O planning during development and production.

Request a quote or submit your procurement inquiry to receive pricing and availability information for XC5VFX130T-2FF1738I. Our team can provide technical details and lead-time options to support your design timeline.