XC5VFX130T-3FFG1738C

The XC5VFX130T-3FFG1738C is a Virtex®-5 FXT field programmable gate array (FPGA) IC from AMD, supplied in a 1738-ball FCBGA package. It provides a high logic capacity and substantial on-chip memory, together with a large number of I/O pins, for designs that require dense integration on a surface-mount board.

Key device attributes include 131,072 logic elements, approximately 10.99 Mbits of embedded RAM, 840 I/Os, a core supply voltage range of 0.95 V to 1.05 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity — 131,072 logic elements provide a large programmable fabric for complex digital designs and custom logic implementations.
• Embedded Memory — Approximately 10.99 Mbits of on-chip RAM to support buffering, packet storage, and intermediate data structures without external memory.
• I/O Density — 840 user I/Os for high-pin-count interfaces and broad peripheral connectivity on a single device.
• Package & Mounting — 1738-ball BGA (1738-FCBGA, 42.5 × 42.5 mm) in a surface-mount format for compact board-level integration.
• Power Supply — Core voltage range of 0.95 V to 1.05 V to match system power architectures requiring precise core rails.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Typical Applications

• High‑density I/O systems — Systems that need many external interfaces can leverage the device's 840 I/O pins for signal aggregation and peripheral connectivity.
• On-chip buffering and memory-centric logic — Designs that require significant embedded memory for buffering or intermediate data storage can use the approximately 10.99 Mbits of RAM.
• Complex programmable logic implementations — Applications that demand a large programmable fabric can take advantage of the 131,072 logic elements for custom algorithms and parallel processing architectures.
• Compact board-level integration — The 1738‑ball FCBGA package supports high-density placement in surface-mount PCB designs where board area and routing density are considerations.

Unique Advantages

• High programmable capacity: 131,072 logic elements enable substantial on-chip implementation of complex logic and state machines, reducing reliance on multiple discrete devices.
• Substantial embedded memory: Approximately 10.99 Mbits of on-chip RAM helps minimize external memory requirements and simplifies BOM and board routing.
• Exceptional I/O count: 840 I/Os provide flexibility for multiple parallel interfaces, sensors, or high-speed links without external multiplexing.
• Compact FCBGA package: The 1738‑FBGA (42.5 × 42.5 mm) package delivers high pin density in a surface-mount form factor for space-constrained designs.
• Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial environmental and regulatory requirements.
• Precise core supply window: Core voltage support from 0.95 V to 1.05 V assists integration into regulated power systems with defined core rails.

Why Choose XC5VFX130T-3FFG1738C?

The XC5VFX130T-3FFG1738C positions itself as a high-capacity, high-I/O FPGA option within the Virtex‑5 FXT family, combining a large programmable fabric with substantial on-chip RAM and broad I/O capability. Its FCBGA package and surface-mount mounting support compact, high-density board designs while the commercial temperature rating and RoHS compliance address common production requirements.

This device is well suited for designers and system integrators who need significant logic and memory resources on a single component, high I/O counts for complex interfacing, and a package that supports dense PCB layouts. Its specification profile supports scalable designs where integration and on-chip resources can reduce external components and simplify system architecture.

To request pricing, availability, or to submit a quote for the XC5VFX130T-3FFG1738C, please request a quote or contact our sales team with your requirements.