XC5VFX130T-2FFG1738I

The XC5VFX130T-2FFG1738I is a Virtex‑5 FXT field programmable gate array (FPGA) in a 1738‑FCBGA package. It combines high logic density, substantial on‑chip RAM, and a large I/O count in an industrial‑grade, surface‑mount form factor.

Designed for systems requiring programmable digital logic with robust operating conditions, this device offers a balance of integration and scalability for embedded and industrial designs where high I/O, significant embedded memory, and constrained core voltage operation are important.

Key Features

• Logic Density 131,072 logic elements provide significant resources for complex custom digital functions and large-scale FPGA designs.
• Embedded Memory Approximately 11 Mbits of on‑chip RAM support buffering, lookup tables, and memory‑intensive logic functions.
• I/O Capacity 840 user I/O pins enable extensive peripheral interfacing and parallel connectivity options.
• Power and Core Voltage Operates from a core voltage range of 950 mV to 1.05 V to match system power rails and enable controlled power design.
• Package and Mounting 1738‑FCBGA (1738‑BBGA) surface‑mount package (supplier device package: 1738‑FCBGA (42.5x42.5)) for high‑density board integration.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• RoHS Compliant Conforms to RoHS requirements for lead‑free assembly compatibility.

Typical Applications

• Industrial control and automation — Leverage the industrial‑grade temperature range and large I/O count for sensor and actuator interfacing and custom control logic.
• Embedded processing and prototyping — Use the high logic element count and embedded memory to implement complex algorithms and system prototypes.
• High‑density I/O systems — Deploy the 840 I/O pins for board‑level aggregation, signal routing, and peripheral expansion in dense assemblies.

Unique Advantages

• High logic capacity: 131,072 logic elements provide the headroom needed for large, multi‑block designs.
• Substantial on‑chip memory: Approximately 11 Mbits of embedded RAM reduces reliance on external memory for buffering and LUT‑based functions.
• Extensive I/O: 840 I/O pins simplify external interfacing and reduce the need for additional interface components.
• Industrial reliability: Qualified for operation from −40 °C to 100 °C to support demanding environmental conditions.
• Compact surface‑mount FCBGA: The 1738‑FCBGA package supports high‑density PCB layouts while maintaining robust connectivity.
• RoHS compliance: Supports lead‑free manufacturing and aligns with common environmental requirements.

Why Choose XC5VFX130T-2FFG1738I?

The XC5VFX130T-2FFG1738I positions itself as a high‑capacity programmable logic device that combines significant logic resources, sizeable embedded memory, and a large I/O complement in an industrial‑rated package. Its core voltage range and surface‑mount FCBGA footprint make it suitable for systems where power management, board density, and environmental robustness matter.

This FPGA is a practical choice for teams designing industrial and complex embedded systems that require scalable logic, plentiful on‑chip RAM, and extensive external interfacing while maintaining RoHS compliance and wide operating temperatures.

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