XC5VFX130T-1FF1738I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 840 10985472 131072 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,965 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 840 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 10240 | Number of Logic Elements/Cells | 131072 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10985472 |
Overview of XC5VFX130T-1FF1738I – Virtex®-5 FXT FPGA, 1738-FCBGA (Industrial)
The XC5VFX130T-1FF1738I is a Virtex®-5 FXT field programmable gate array (FPGA) offered in a 1738-ball FCBGA package. It combines a high count of logic elements and on-chip memory with a large I/O complement to support complex digital designs.
Targeted at industrial applications, this device provides a balance of integration and configurability for designs that require substantial embedded memory, dense logic resources, and extensive external interfacing while operating across an industrial temperature range.
Key Features
- Logic Capacity — 131,072 logic elements provide substantial programmable logic resources for implementing complex digital functions.
- Embedded Memory — Approximately 10.99 Mbits of on-chip RAM enable local data buffering, FIFOs, and temporary storage for high-throughput designs.
- I/O Density — 840 user I/O pins support wide external interfaces, high-pin-count peripherals, and parallel data paths.
- Power — Core supply range specified from 950 mV to 1.05 V to match system power-rail planning and regulator selection.
- Package and Mounting — 1738-ball FCBGA package (1738-FCBGA, 42.5 × 42.5 mm) in a surface-mount form factor for compact board-level integration.
- Operating Temperature — Rated for −40 °C to 100 °C, suitable for industrial temperature environments.
- Compliance — RoHS-compliant, aligning with common environmental directives for electronic assemblies.
Typical Applications
- Industrial Control — Implement real-time control logic, sensor interfacing, and custom motor-control algorithms using the device's high logic and I/O resources.
- Data Acquisition and Processing — Use the on-chip memory and abundant I/O for buffering and preprocessing high-bandwidth sensor or instrumentation data streams.
- High-Density Digital Systems — Integrate complex processing pipelines, protocol bridging, and custom accelerators where substantial logic capacity and embedded RAM are required.
Unique Advantages
- Substantial Logic Resources: 131,072 logic elements enable large, multi-function designs without immediate partitioning across multiple devices.
- Significant Embedded Memory: Approximately 10.99 Mbits of on-chip RAM reduces external memory dependencies and simplifies board-level design.
- High I/O Count: 840 user I/O pins support extensive external interfacing options, allowing flexible connectivity to sensors, peripherals, and high-speed buses.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployments in demanding environmental conditions.
- Compact FCBGA Package: The 1738-FCBGA (42.5 × 42.5 mm) surface-mount package provides a high-pin-count solution in a compact footprint for dense PCB layouts.
- RoHS Compliance: Aligns with common environmental standards for modern electronic products.
Why Choose XC5VFX130T-1FF1738I?
The XC5VFX130T-1FF1738I positions itself as a high-capacity, industrial-grade FPGA suited for designs demanding large programmable logic resources, ample embedded memory, and broad I/O capability. Its specification profile supports complex digital systems where integration and environmental robustness are key considerations.
This device is well suited for engineering teams developing industrial control systems, high-density data acquisition or custom processing solutions who require a scalable, reliable FPGA platform with clear electrical and thermal operating parameters.
If you would like pricing, availability, or a tailored quote for the XC5VFX130T-1FF1738I, request a quote or contact our sales team to begin the procurement process.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








