XC5VFX100T-2FFG1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 8404992 102400 1136-BBGA, FCBGA

Quantity 869 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8404992

Overview of XC5VFX100T-2FFG1136I – Virtex®-5 FXT Field Programmable Gate Array (Industrial)

The XC5VFX100T-2FFG1136I is a Virtex®-5 FXT field programmable gate array (FPGA) packaged in a 1136-ball FCBGA. It provides a large logic resource and on-chip memory alongside a high I/O count for designs that require substantial integration in a surface-mount, industrial-grade device.

Key hardware specifications include approximately 102,400 logic elements, roughly 8.4 Mbits of embedded RAM, 640 I/Os, an operating voltage range of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core / Logic capacity — Approximately 102,400 logic elements and 8,000 logic blocks provide extensive programmable fabric for complex digital designs.
  • Embedded memory — Approximately 8.4 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
  • I/O density — 640 general-purpose I/Os to support wide parallel interfaces, large connector pinouts, or multiple peripheral connections.
  • Package — 1136-ball BGA package; supplier device package listed as 1136-FCBGA (35×35), delivering a compact surface-mount solution for high-pin-count applications.
  • Power — Core supply voltage range from 950 mV to 1.05 V to match platform power requirements.
  • Temperature and grade — Industrial-grade device with an operating range of −40 °C to 100 °C for extended-temperature applications.
  • Mounting and compliance — Surface-mount packaging and RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

  • High-density digital systems — Implements complex state machines, protocol bridges, or custom compute pipelines using the device’s large logic and embedded RAM capacity.
  • I/O-intensive interfaces — Supports systems requiring many external connections, parallel buses, or multi-channel I/O thanks to 640 available I/Os.
  • Industrial control and instrumentation — Industrial-grade temperature range and robust packaging suit control, monitoring, and instrumentation applications that operate across extended temperatures.

Unique Advantages

  • Large programmable fabric: Approximately 102,400 logic elements enable substantial on-chip implementation of custom digital logic without external ASICs.
  • Significant on-chip memory: Approximately 8.4 Mbits of embedded RAM reduces external memory dependencies for buffering and state retention.
  • High I/O capacity: 640 I/Os simplify board-level routing for complex multi-interface or high-channel-count designs.
  • Compact, high-pin-count package: 1136-FCBGA (35×35) delivers a dense pinout in a surface-mount form factor for space-constrained PCBs.
  • Industrial operating range: −40 °C to 100 °C operation supports deployments in environments with wide temperature variation.
  • Standards-friendly manufacturing: Surface-mount design and RoHS compliance align with common production and regulatory requirements.

Why Choose XC5VFX100T-2FFG1136I?

The XC5VFX100T-2FFG1136I combines substantial logic capacity, multi-megabit embedded memory, and a high I/O count in an industrial-grade, surface-mount 1136-ball FCBGA package. Its electrical and thermal specifications provide a clear basis for designs that require large on-chip integration and reliable operation across extended temperatures.

This device is well suited to engineers and teams building complex digital systems that need to minimize external components while retaining flexible, field-programmable hardware. The combination of logic density, embedded RAM, and I/O density supports scalable designs and long-term deployment in industrial environments.

Request a quote or submit an inquiry to get pricing and availability information for the XC5VFX100T-2FFG1136I and to begin the procurement process.

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