XC5VFX100T-2FF1136I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 8404992 102400 1136-BBGA, FCBGA |
|---|---|
| Quantity | 149 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8000 | Number of Logic Elements/Cells | 102400 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8404992 |
Overview of XC5VFX100T-2FF1136I – Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC
The XC5VFX100T-2FF1136I is a Virtex®-5 FXT field programmable gate array optimized for high-density digital designs. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex custom processing and interfacing requirements.
Designed for industrial temperature operation, this surface-mount FPGA targets applications that require extensive logic resources, on-chip memory, and broad connectivity while operating from a core supply of 950 mV to 1.05 V.
Key Features
- Logic Capacity Provides 102,400 logic elements to implement large-scale custom digital functions and parallel processing architectures.
- Embedded Memory Approximately 8.4 Mbits of on-chip RAM to support buffering, look-up tables, and data-local processing tasks.
- I/O Density 640 programmable I/O pins to support wide buses, multiple interfaces, and high-pin-count system integration.
- Power Supply Operates from a core voltage range of 950 mV to 1.05 V, enabling defined power budgeting for system design.
- Package 1136-FCBGA package (1136-BBGA, FCBGA) with supplier device package listed as 1136-FCBGA (35x35), suitable for high-pin-count board layouts.
- Temperature Range Industrial-grade operation from -40 °C to 100 °C for deployment in demanding environments.
- Mounting & Compliance Surface-mount device with RoHS compliance for modern assembly and regulatory requirements.
Typical Applications
- High-density digital processing Implements large custom logic blocks and parallel pipelines using 102,400 logic elements and extensive on-chip RAM.
- Embedded system interfacing Supports systems requiring high I/O counts for wide buses, multiple peripherals, and complex connectivity.
- Industrial control and automation Industrial temperature rating (-40 °C to 100 °C) makes it suitable for control systems and equipment in challenging environments.
- Memory-intensive algorithms On-chip memory (~8.4 Mbits) supports buffering, data staging, and local algorithm storage for real-time processing.
Unique Advantages
- Substantial logic resources: 102,400 logic elements enable implementation of large and complex custom designs without immediate partitioning across devices.
- Significant embedded memory: Approximately 8.4 Mbits of on-chip RAM reduces dependence on external memory for many buffering and local storage needs.
- High I/O count: 640 I/Os simplify integration with multi-channel interfaces, wide data buses, and mixed-signal front ends.
- Industrial temperature capability: Rated from -40 °C to 100 °C to support deployment in temperature-challenging applications.
- Compact, high-pin package: 1136-FCBGA package supports dense routing and high I/O density in space-constrained board designs.
- Regulatory compliance: RoHS-compliant construction aligns with current environmental and assembly standards.
Why Choose XC5VFX100T-2FF1136I?
The XC5VFX100T-2FF1136I positions itself as a high-capacity FPGA solution that balances logic density, embedded memory, and extensive I/O within an industrial-temperature, surface-mount package. Its combination of 102,400 logic elements and approximately 8.4 Mbits of on-chip RAM makes it well suited for designs demanding large custom logic, substantial local data storage, and broad interfacing capability.
This device is appropriate for engineering teams developing complex digital processing, industrial control, or high-I/O embedded systems that require a robust, high-density FPGA platform with a defined core voltage range and industrial temperature operation.
Request a quote or submit a sales inquiry to evaluate XC5VFX100T-2FF1136I for your next design and receive pricing and availability details tailored to your requirements.

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