XC5VFX100T-1FFG1738C

IC FPGA 680 I/O 1738FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 680 8404992 102400 1738-BBGA, FCBGA

Quantity 1,586 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O680Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8404992

Overview of XC5VFX100T-1FFG1738C – Virtex®-5 FXT FPGA, 1738‑BBGA (FCBGA)

The XC5VFX100T-1FFG1738C is a Virtex®-5 FXT field programmable gate array (FPGA) from AMD, supplied in a 1738‑pin FCBGA package. It provides a large pool of programmable logic, embedded memory, and extensive I/O for commercial electronic designs.

This device is intended for applications that require significant on-chip logic capacity, substantial embedded RAM, and a high I/O count, all in a surface‑mount FCBGA package with a commercial operating temperature range.

Key Features

  • Logic Capacity  Approximately 102,400 logic elements to implement complex, custom digital functions and large-scale programmable logic designs.
  • Configurable Logic Blocks  Device includes 8,000 configurable logic blocks for structured logic implementation and design partitioning.
  • Embedded Memory  Approximately 8.4 Mbits of on‑chip RAM to support data buffering, state machines, and local storage requirements.
  • I/O Density  680 user I/O pins, enabling multiple parallel interfaces and connection to a wide range of peripherals and external devices.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V, suitable for the device’s specified operating conditions.
  • Package & Mounting  1738‑BBGA (1738‑FCBGA) surface‑mount package, supplier package dimensions 1738‑FCBGA (42.5×42.5 mm), optimizing board density for high‑pin‑count FPGA designs.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Communications Equipment  Use the device to implement custom digital logic and multiple I/O interfaces for network and protocol handling in commercial communications systems.
  • Embedded Systems  Deploy as the central programmable fabric in embedded designs that require abundant logic resources and on‑chip RAM for control and data processing.
  • Signal Processing  Leverage the large logic and memory capacity for digital signal processing functions and data buffering in commercial DSP applications.
  • High‑Pin‑Count Interface Hubs  Utilize the 680 I/O pins to aggregate and route signals between multiple external devices and subsystems on a single board.

Unique Advantages

  • High Logic Density: Approximately 102,400 logic elements provide significant capacity for complex custom logic and large designs.
  • Substantial Embedded Memory: Approximately 8.4 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O Count: 680 user I/O pins enable dense external connectivity and support multiple parallel interfaces.
  • Compact, High‑Pin Package: The 1738‑FCBGA (42.5×42.5 mm) surface‑mount package delivers high pin count in a board‑friendly footprint.
  • Commercial Temperature Suitability: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose XC5VFX100T-1FFG1738C?

The XC5VFX100T-1FFG1738C combines a large pool of programmable logic, meaningful on‑chip memory, and a very high I/O count in a single commercial‑grade FCBGA package from AMD. It is positioned for designs that require dense, reconfigurable logic capacity and broad external connectivity while maintaining standard commercial operating conditions.

This FPGA is suited for engineers and procurement teams building commercial embedded systems, communications equipment, and signal processing platforms that benefit from integrated memory and high pin counts—providing scalability and design flexibility within a compact surface‑mount package.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VFX100T-1FFG1738C.

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