XC5VFX100T-1FFG1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 8404992 102400 1136-BBGA, FCBGA

Quantity 1,687 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8404992

Overview of XC5VFX100T-1FFG1136I – Virtex®-5 FXT FPGA, 1136-FCBGA

The XC5VFX100T-1FFG1136I is a Virtex-5 FXT field programmable gate array (FPGA) from AMD, provided in a 1136-FCBGA (35×35) surface-mount package. It delivers a large programmable fabric suitable for designs that require substantial logic capacity, extensive I/O, and embedded memory within an industrial temperature range.

With 102,400 logic elements, approximately 8.4 Mbits of embedded memory, and up to 640 user I/O, this device is positioned for applications that need dense logic integration, significant on-chip buffering, and a high pin-count interface while operating from a 0.95 V to 1.05 V core supply and across −40 °C to 100 °C. The part is RoHS compliant and offered in an industrial grade package for surface-mount assembly.

Key Features

  • FPGA Architecture  Virtex-5 FXT field programmable gate array providing a reprogrammable logic fabric for custom digital designs.
  • Logic Capacity  102,400 logic elements to implement complex logic, state machines, and custom processing pipelines.
  • Embedded Memory  Approximately 8.4 Mbits of on-chip RAM for buffering, local storage, and data-path staging.
  • High I/O Count  Up to 640 user I/O pins to support high-density parallel interfaces and multi-channel connectivity.
  • Power  Core voltage supply range from 0.95 V to 1.05 V to match system-level power architectures.
  • Package & Mounting  1136-BBGA / 1136-FCBGA (35×35) surface-mount package for compact, high-pin-count board designs.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance  RoHS compliant for restriction of hazardous substances in manufacturing.

Typical Applications

  • Industrial Control and Automation  Use the device where substantial logic and I/O are required to implement control algorithms, signal processing, and real-time interfacing in industrial equipment.
  • High-Density I/O Systems  Ideal for applications that require many parallel interfaces or multi-channel connectivity leveraging the 640 available I/O pins.
  • Embedded Processing and Data Buffering  On-chip memory of approximately 8.4 Mbits supports local buffering, data staging, and low-latency processing close to the logic fabric.
  • Prototyping and Custom Logic  Suitable for engineering and development platforms that need a reprogrammable, industrial-grade FPGA with substantial logic resources.

Unique Advantages

  • Large Logic Resource: 102,400 logic elements enable implementation of complex, scaled digital systems on a single device, reducing system-level component count.
  • Significant On-Chip Memory: Approximately 8.4 Mbits of embedded RAM supports buffering and local data operations, improving data throughput and latency.
  • Extensive I/O Capacity: 640 I/O pins provide flexibility for parallel interfaces, multi-channel aggregation, or high-speed external connectivity.
  • Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
  • Compact High-Pin Package: 1136-FCBGA (35×35) surface-mount package offers a high pin-count footprint for dense board integration.
  • Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing processes.

Why Choose XC5VFX100T-1FFG1136I?

The XC5VFX100T-1FFG1136I brings together a large programmable fabric, substantial embedded memory, and a high I/O count in an industrial-grade, RoHS-compliant FCBGA package. Its specified core voltage range and extended operating temperature make it suitable for designs that demand reliable, high-density logic integration in challenging environments.

This device is well suited to engineering teams and procurement looking for a scalable FPGA platform that balances logic capacity, on-chip memory, and interface density—enabling consolidation of functions and reduced BOM in complex digital systems.

Request a quote or submit an inquiry to receive pricing and availability information for XC5VFX100T-1FFG1136I. Our team will respond with a tailored offer and lead-time details.

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