XC5VFX100T-1FF1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 8404992 102400 1136-BBGA, FCBGA

Quantity 396 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8404992

Overview of XC5VFX100T-1FF1136I – Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC

The XC5VFX100T-1FF1136I is a Virtex‑5 FXT field programmable gate array (FPGA) IC from AMD. It combines a large logic fabric with substantial on‑chip memory and a high I/O count to support designs that require dense programmable logic and extensive local storage.

This industrial‑grade, surface‑mount device is supplied in a 1136‑FBGA (1136‑FCBGA, 35×35) package and operates across a supply range of 0.950 V to 1.05 V and an ambient temperature range of −40 °C to 100 °C, making it suitable for demanding embedded applications requiring wide operating conditions and RoHS compliance.

Key Features

  • Logic Capacity  Provides 102,400 logic elements to implement complex programmable logic functions and custom algorithms.
  • Embedded Memory  Includes approximately 8.4 Mbits of on‑chip RAM for local buffering, state storage, and memory‑intensive logic functions.
  • I/O Resources  Offers 640 user I/Os to support extensive peripheral connectivity and multi‑channel interfacing.
  • Power and Core Voltage  Operates from a core voltage range of 0.950 V to 1.05 V, enabling predictable power design and integration with system power rails.
  • Package and Mounting  Packaged in a 1136‑BBGA, FCBGA (1136‑FCBGA, 35×35) surface‑mount package for high‑density board integration.
  • Operating Range  Industrial operating temperature from −40 °C to 100 °C for use in environments with wide thermal variation.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • High‑density digital systems  Deploys the large logic element count to implement complex state machines, datapaths, and custom hardware accelerators where significant programmable logic is required.
  • Memory‑intensive designs  Utilizes approximately 8.4 Mbits of embedded RAM for on‑chip buffering, FIFOs, and local data storage to reduce external memory dependence.
  • I/O‑rich interfaces  Leverages 640 I/Os to connect multiple sensors, peripherals, or high‑channel count interfaces in connectivity‑focused applications.
  • Industrial embedded systems  Industrial temperature rating (−40 °C to 100 °C) and surface‑mount FCBGA packaging address the needs of robust embedded deployments.

Unique Advantages

  • Large logic resource pool:  102,400 logic elements enable implementation of sizable custom logic and parallel processing architectures.
  • Substantial on‑chip memory:  Approximately 8.4 Mbits of embedded RAM supports buffering and stateful designs without immediate reliance on external memory.
  • Extensive connectivity:  640 I/Os provide flexibility to interface with numerous peripherals and multi‑lane communications.
  • Industrial temperature capability:  Rated for −40 °C to 100 °C operation to meet thermal requirements in industrial environments.
  • Compact, high‑density package:  1136‑FBGA (1136‑FCBGA, 35×35) surface‑mount packaging enables dense PCB implementation for space constrained systems.
  • Controlled core voltage range:  Core supply specified at 0.950 V to 1.05 V for consistent power integration.

Why Choose XC5VFX100T-1FF1136I?

The XC5VFX100T-1FF1136I positions itself for designs that demand a combination of high logic capacity, significant on‑chip memory, and broad I/O connectivity within an industrial temperature envelope. Its packaging and electrical specifications make it a practical choice for embedded systems that need dense programmable logic and reliable operation across a wide temperature range.

As a Virtex‑5 FXT FPGA from AMD, this device provides the raw resources—102,400 logic elements, approximately 8.4 Mbits of embedded RAM, and 640 I/Os—needed to implement complex, memory‑aware, and I/O‑intensive designs while meeting RoHS requirements.

Request a quote or submit an inquiry to begin evaluating the XC5VFX100T-1FF1136I for your next design.

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