XC5VFX100T-1FF1136I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 8404992 102400 1136-BBGA, FCBGA |
|---|---|
| Quantity | 396 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8000 | Number of Logic Elements/Cells | 102400 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8404992 |
Overview of XC5VFX100T-1FF1136I – Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC
The XC5VFX100T-1FF1136I is a Virtex‑5 FXT field programmable gate array (FPGA) IC from AMD. It combines a large logic fabric with substantial on‑chip memory and a high I/O count to support designs that require dense programmable logic and extensive local storage.
This industrial‑grade, surface‑mount device is supplied in a 1136‑FBGA (1136‑FCBGA, 35×35) package and operates across a supply range of 0.950 V to 1.05 V and an ambient temperature range of −40 °C to 100 °C, making it suitable for demanding embedded applications requiring wide operating conditions and RoHS compliance.
Key Features
- Logic Capacity Provides 102,400 logic elements to implement complex programmable logic functions and custom algorithms.
- Embedded Memory Includes approximately 8.4 Mbits of on‑chip RAM for local buffering, state storage, and memory‑intensive logic functions.
- I/O Resources Offers 640 user I/Os to support extensive peripheral connectivity and multi‑channel interfacing.
- Power and Core Voltage Operates from a core voltage range of 0.950 V to 1.05 V, enabling predictable power design and integration with system power rails.
- Package and Mounting Packaged in a 1136‑BBGA, FCBGA (1136‑FCBGA, 35×35) surface‑mount package for high‑density board integration.
- Operating Range Industrial operating temperature from −40 °C to 100 °C for use in environments with wide thermal variation.
- Regulatory Compliance RoHS compliant.
Typical Applications
- High‑density digital systems Deploys the large logic element count to implement complex state machines, datapaths, and custom hardware accelerators where significant programmable logic is required.
- Memory‑intensive designs Utilizes approximately 8.4 Mbits of embedded RAM for on‑chip buffering, FIFOs, and local data storage to reduce external memory dependence.
- I/O‑rich interfaces Leverages 640 I/Os to connect multiple sensors, peripherals, or high‑channel count interfaces in connectivity‑focused applications.
- Industrial embedded systems Industrial temperature rating (−40 °C to 100 °C) and surface‑mount FCBGA packaging address the needs of robust embedded deployments.
Unique Advantages
- Large logic resource pool: 102,400 logic elements enable implementation of sizable custom logic and parallel processing architectures.
- Substantial on‑chip memory: Approximately 8.4 Mbits of embedded RAM supports buffering and stateful designs without immediate reliance on external memory.
- Extensive connectivity: 640 I/Os provide flexibility to interface with numerous peripherals and multi‑lane communications.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet thermal requirements in industrial environments.
- Compact, high‑density package: 1136‑FBGA (1136‑FCBGA, 35×35) surface‑mount packaging enables dense PCB implementation for space constrained systems.
- Controlled core voltage range: Core supply specified at 0.950 V to 1.05 V for consistent power integration.
Why Choose XC5VFX100T-1FF1136I?
The XC5VFX100T-1FF1136I positions itself for designs that demand a combination of high logic capacity, significant on‑chip memory, and broad I/O connectivity within an industrial temperature envelope. Its packaging and electrical specifications make it a practical choice for embedded systems that need dense programmable logic and reliable operation across a wide temperature range.
As a Virtex‑5 FXT FPGA from AMD, this device provides the raw resources—102,400 logic elements, approximately 8.4 Mbits of embedded RAM, and 640 I/Os—needed to implement complex, memory‑aware, and I/O‑intensive designs while meeting RoHS requirements.
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