XC5215-6HQ208IO359

The XC5215-6HQ208IO359 is an AMD XC5200-series Field Programmable Gate Array (FPGA) supplied in a 208‑pin BFQFP package with exposed pad. It provides a compact, industrial‑grade programmable logic solution with 1,936 logic elements and a high I/O count for designs that require on‑board customization and dense peripheral connectivity.

With a 4.5 V to 5.5 V supply range, 164 user I/O pins, and an operating temperature range of −40 °C to 100 °C, this FPGA targets applications that need reliable, reprogrammable logic in surface‑mount form factors.

Key Features

• Core Capacity  Provides 1,936 logic elements and approximately 23,000 gates to implement custom digital functions and control logic.
• Logic Structure  Contains 484 logic blocks (as specified) to organize combinational and sequential resources for medium‑complexity designs.
• I/O Density  Offers 164 general‑purpose I/O pins to interface with multiple peripherals, sensors, and external logic devices.
• Power  Operates from a 4.5 V to 5.5 V supply range to match common system rails.
• Package & Mounting  Supplied in a 208‑BFQFP exposed pad package (supplier device package: 208‑PQFP, 28×28) for surface‑mount PCB assembly.
• Environmental & Reliability  Industrial grade operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Industrial Control Systems  Suitable for control logic and I/O aggregation in systems operating across −40 °C to 100 °C where industrial‑grade components are required.
• Embedded Logic and Glue Logic  Implements custom combinational and sequential functions using its 1,936 logic elements and ~23,000 gates to reduce external component count.
• I/O‑Dense Interface Boards  Provides 164 I/O pins for designs that need to connect many peripherals, sensors, or submodules in a compact package.
• Compact Surface‑Mount Designs  The 208‑pin BFQFP exposed‑pad package supports surface‑mount assembly and board‑level integration in space‑constrained layouts.

Unique Advantages

• Well‑balanced logic and I/O: Combines 1,936 logic elements with 164 I/O pins to address medium‑complexity, I/O‑heavy implementations without excessive board complexity.
• Industrial temperature range: Rated for −40 °C to 100 °C operation, enabling deployment in environments that require extended temperature performance.
• Standard 5 V compatibility: Operates from 4.5 V to 5.5 V, aligning with common system power rails for straightforward integration.
• Surface‑mount BFQFP with exposed pad: Offers a 208‑pin footprint (supplier package 208‑PQFP, 28×28) suitable for compact PCB designs and exposed‑pad board mounting.
• RoHS compliant: Meets RoHS requirements to support regulatory and environmental needs.
• Manufacturer backing: Produced by AMD, providing a known supplier for sourcing and lifecycle considerations.

Why Choose XC5215-6HQ208IO359?

The XC5215-6HQ208IO359 positions itself as a practical, industrial‑grade FPGA option that balances programmable logic capacity and high I/O density within a compact 208‑pin BFQFP package. Its 1,936 logic elements, ~23,000 gates, and 164 I/O make it suitable for embedded designs that require flexible, reprogrammable logic while operating on standard 5 V rails and across extended temperature ranges.

Engineers and procurement teams will find this AMD XC5200‑series device appropriate for medium‑complexity control, interface, and glue‑logic tasks where RoHS compliance and supplier continuity are important considerations.

Please request a quote or submit an inquiry to check availability and pricing for the XC5215-6HQ208IO359.