XC5215-6HQ208CO359

FPGA, 324 CLBS, 10000 GATES
Part Description

XC5200 Field Programmable Gate Array (FPGA) IC 164 1936 208-BFQFP Exposed Pad

Quantity 1,048 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O164Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells1936
Number of Gates23000ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of XC5215-6HQ208CO359 – XC5200 Field Programmable Gate Array (FPGA) IC 164 1936 208-BFQFP Exposed Pad

The XC5215-6HQ208CO359 is a field programmable gate array (FPGA) manufactured by AMD, delivering programmable logic resources and a high I/O count in a 208-BFQFP exposed pad package. With 1,936 logic elements and approximately 23,000 gates, this commercial-grade device is specified for 5 V supply systems and supports up to 164 user I/Os.

Its combination of moderate logic capacity, high I/O density, and a compact surface-mount package makes it suitable for designs that require configurable logic in a 208-pin PQFP form factor while operating within commercial temperature limits.

Key Features

  • Core Logic  Approximately 1,936 logic elements and about 23,000 gates provide the programmable logic resources for glue logic, protocol handling, and custom control functions.
  • I/O Density  Up to 164 user I/Os accommodate multiple external interfaces, sensors, and peripheral connections directly to the FPGA fabric.
  • Memory  No embedded on-chip RAM bits are specified for this device.
  • Power  Designed for standard 5 V systems with a supply range of 4.75 V to 5.25 V to match common legacy and industrial logic domains.
  • Package & Mounting  208-BFQFP exposed pad package (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for compact board-level integration.
  • Operating Range & Grade  Commercial-grade device specified for 0 °C to 85 °C operating temperature.
  • Environmental Compliance  RoHS compliant to support environmental requirements for lead-free assembly.

Unique Advantages

  • High I/O count: 164 I/Os enable integration of multiple peripherals and interfaces directly to the FPGA, reducing external logic.
  • Moderate logic capacity: 1,936 logic elements and ~23,000 gates provide the resources needed for mid-range programmable logic tasks without excess board area.
  • Standard 5 V compatibility: Operates from 4.75 V to 5.25 V, simplifying integration into existing 5 V systems and legacy designs.
  • Compact PQFP package with exposed pad: 208-pin BFQFP (28×28) offers a dense footprint for PCB designs while providing a thermal pad for improved board-level heat dissipation.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for applications targeting commercial-environment deployments.
  • RoHS compliant: Meets lead-free assembly requirements for environmentally regulated products.

Why Choose XC5215-6HQ208CO359?

The XC5215-6HQ208CO359 positions itself as a reliable, commercial-grade FPGA option for designs that require moderate programmable logic capacity combined with a high number of I/Os and standard 5 V operation. Its 208-pin BFQFP exposed pad package provides a compact, surface-mount solution suitable for dense board layouts.

Engineers and procurement teams seeking a vendor-backed FPGA with clear electrical and thermal operating parameters will find this AMD device appropriate for mid-range configurable logic tasks where RoHS compliance and compatibility with 5 V systems are important considerations.

Request a quote or submit an inquiry for pricing and availability of the XC5215-6HQ208CO359 to discuss lead times and volume options.

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