XC5215-6HQ208I0359

The XC5200 XC5215-6HQ208I0359 is a field programmable gate array (FPGA) device from AMD designed for industrial-grade embedded logic applications. It provides a compact, surface-mount FPGA solution with a balance of logic capacity, I/O density and standard 5 V power compatibility.

Key characteristics include 1,936 logic elements, 164 I/O pins, an estimated 23,000 gate equivalent capacity, operation across a 4.5 V to 5.5 V supply range, and an industrial operating temperature window of −40 °C to 100 °C. The device is supplied in a 208-pin BFQFP package with an exposed pad for thermal performance.

Key Features

• Core Logic  Approximately 1,936 logic elements and a reported 23,000 gate-equivalent capacity provide programmable combinational and sequential logic resources.
• I/O Density  164 general-purpose I/O pins support substantial external interfacing for peripheral, bus and sensor connections.
• Memory  Total on-chip RAM reported as 0 bits; device is intended for designs that rely on external memory or primarily combinational/sequential logic implementation.
• Power  Operates from a 4.5 V to 5.5 V supply range, aligning with standard 5 V system power domains.
• Package & Mounting  208‑BFQFP with exposed pad (supplier package listed as 208‑PQFP 28×28) in a surface-mount format to support PCB assembly and thermal management.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for applications requiring extended temperature capability.
• Compliance  RoHS compliant, supporting lead-free manufacturing processes.

Unique Advantages

• High I/O capacity: 164 I/O pins let you connect multiple peripherals, buses and external devices without additional I/O expanders.
• Compact package with thermal pad: 208‑BFQFP exposed pad construction enables dense board integration while providing a path for thermal dissipation.
• Industrial-rated operation: −40 °C to 100 °C temperature range and a 5 V-compatible power envelope support deployment in industrial environments.
• Balanced logic resources: Nearly 2,000 logic elements and ~23,000 gates provide a mid-range programmable fabric suitable for control, glue-logic and interface tasks.
• Surface-mount convenience: Standard surface-mount package simplifies automated assembly and reflow processes for volume manufacturing.

Why Choose XC5215-6HQ208I0359?

The XC5215-6HQ208I0359 positions itself as a practical, industrial-grade FPGA option where moderate logic capacity and substantial I/O are required within a standardized 208‑pin surface-mount package. Its 4.5 V–5.5 V supply compatibility and −40 °C to 100 °C operating range make it suitable for embedded systems designed for robust environments.

Choose this part when you need a mid-density programmable logic device that integrates well into 5 V system architectures, requires a high number of discrete I/Os, and benefits from the thermal handling advantages of an exposed-pad BFQFP package.

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