XC5VFX100T-2FFG1136C

The XC5VFX100T-2FFG1136C is a Virtex®-5 FXT field programmable gate array (FPGA) in a 1136-ball FCBGA package. It combines a large programmable logic capacity with significant on-chip memory and a high pin count to support complex, high-density digital designs.

Designed for commercial-grade applications, this device offers a balance of integration and I/O capability for designs that require substantial logic resources, embedded memory, and extensive external connectivity within a single surface-mount package.

Key Features

• Logic Capacity — Provides 102,400 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded Memory — Approximately 8.4 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive logic tasks.
• High I/O Count — 640 user I/O pins to enable broad external device interfacing and parallel connectivity.
• Package & Mounting — Available in a 1136-FCBGA (35 × 35 mm) / 1136-BBGA package with surface-mount mounting for compact board-level integration.
• Power — Core supply range from 950 mV to 1.05 V, suitable for designs targeting this core-voltage window.
• Operating Range & Grade — Commercial grade operation with a specified ambient temperature range of 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for regulation-aligned deployments.

Typical Applications

• High-density programmable logic designs — Use the large logic element count to consolidate complex state machines, protocol handlers, and custom datapaths on-chip.
• Memory‑intensive logic — Leverage approximately 8.4 Mbits of embedded RAM for buffering, FIFO structures, and on-chip data storage.
• High I/O interfacing — Utilize 640 I/O pins for wide parallel buses, multiple external peripherals, or multi-channel I/O implementations.

Unique Advantages

• Large integrated logic capacity: 102,400 logic elements reduce the need for multiple devices and simplify board-level partitioning.
• Substantial on-chip memory: Approximately 8.4 Mbits of embedded RAM supports local data handling and lowers external memory requirements.
• Extensive external connectivity: 640 I/O pins enable flexible interfacing options and support for multi‑channel or parallel architectures.
• Compact high-density package: 1136-FCBGA (35 × 35 mm) offers a space-efficient platform for integrating significant functionality on a single FPGA.
• Commercial temperature rating: 0 °C to 85 °C aligns the device with a wide range of commercial embedded applications.
• RoHS compliant: Supports environmentally regulated designs and supply-chain requirements.

Why Choose XC5VFX100T-2FFG1136C?

The XC5VFX100T-2FFG1136C positions itself as a high-capacity, commercially graded FPGA that brings together a large number of logic elements, meaningful embedded memory, and a high I/O complement in a single 1136-FCBGA surface-mount package. It is well suited to designs that need substantial on-chip resources and extensive external connectivity without resorting to multi-device solutions.

For teams targeting commercial applications that demand scalability and integration, this device provides a compact, RoHS-compliant option with clearly specified power and temperature parameters to support predictable design and procurement decisions.

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