XC5VFX30T-1FF665CES
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,011 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 32768 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2506752 |
Overview of XC5VFX30T-1FF665CES – Virtex®-5 FXT FPGA, 665‑FCBGA
The XC5VFX30T-1FF665CES is a Virtex®-5 FXT field programmable gate array (FPGA) packaged in a 665‑ball FCBGA. It combines substantial logic capacity and embedded memory with a high I/O count to support complex, commercially graded digital designs.
Designed for surface-mount board implementation, this device provides a balance of integration and power efficiency through a 0.95–1.05 V core supply and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core and Logic Capacity 32,768 logic elements and 2,560 CLBs provide the programmable fabric needed for mid-to-high complexity logic implementations.
- Embedded Memory Approximately 2.5 Mbits of on-chip RAM for buffering, FIFOs, and state storage inside the programmable logic.
- I/O Resources 360 user I/O pins to support parallel interfaces, signaling banks, and external device connectivity.
- Power Core voltage supply range of 0.95 V to 1.05 V for controlled power budgeting and core voltage planning.
- Package and Mounting 665‑FCBGA (27 × 27 mm) package case (665‑BBGA, FCBGA) designed for surface-mount PCB assembly.
- Operating Conditions & Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Unique Advantages
- High logic density: 32,768 logic elements enable implementation of sizeable custom logic, reducing the need for multiple devices.
- Significant on‑chip RAM: Approximately 2.5 Mbits of embedded memory supports data buffering and local storage for latency-sensitive functions.
- Ample I/O: 360 I/Os allow flexible system partitioning and the ability to interface with numerous peripherals or parallel buses.
- Compact, high‑pin package: The 665‑FCBGA (27×27 mm) delivers large pin count in a board-efficient footprint for dense system designs.
- Commercial-ready operating range: 0 °C to 85 °C rating aligns with a wide range of commercial electronic applications.
- RoHS compliant: Environmentally compliant manufacturing status simplifies regulatory handling for commercial products.
Why Choose XC5VFX30T-1FF665CES?
The XC5VFX30T-1FF665CES positions itself as a capable Virtex‑5 FXT FPGA option for commercial designs that require a combination of sizeable logic resources, on-chip memory, and a high number of I/Os in a compact FCBGA package. Its supply voltage range and commercial temperature rating make it suitable for a broad set of board-level implementations where predictable electrical and thermal behavior is needed.
This device suits engineering teams seeking scalable programmable logic with clear, verifiable specifications for logic capacity, memory, I/O, package, and operating conditions—helping simplify system architecture and component selection while leveraging a known FPGA family.
Request a quote or submit your requirements today to get pricing and availability for the XC5VFX30T-1FF665CES.

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