XC5VFX200T-2FF1738CES

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 960 16809984 196608 1738-BBGA, FCBGA

Quantity 1,391 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15360Number of Logic Elements/Cells196608
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits16809984

Overview of XC5VFX200T-2FF1738CES – Virtex-5 FXT FPGA, 1738-FCBGA

The XC5VFX200T-2FF1738CES is an AMD Virtex®-5 FXT Field Programmable Gate Array (FPGA) supplied in a 1738-ball FCBGA package. It provides a large programmable fabric with extensive on-chip memory and high I/O count for commercial electronic designs that require substantial logic density and embedded storage.

Key attributes include a substantial logic element count, approximately 16.81 Mbits of embedded RAM, and a high I/O complement, making the device suitable for complex digital implementations within the commercial temperature range.

Key Features

  • Core logic capacity — 196,608 logic elements provide a large programmable fabric for implementing complex digital functions.
  • Logic block count — 15,360 reported logic blocks to map and organize designs at block granularity.
  • Embedded memory — approximately 16.81 Mbits (16,809,984 bits) of on-chip RAM for buffering, FIFO, and local storage needs.
  • I/O density — 960 user I/Os to support wide parallel interfaces and multiple external peripherals.
  • Package — 1738-FCBGA (42.5 × 42.5 mm) package for high-density board-level integration.
  • Power — Core voltage supply range of 0.95 V to 1.05 V to match typical FPGA core power rails.
  • Operating range — Commercial grade operation from 0 °C to 85 °C.
  • Environmental — RoHS compliant.

Unique Advantages

  • Large programmable fabric: 196,608 logic elements enable implementation of complex logic and parallel processing without external PLDs.
  • Substantial on-chip RAM: Approximately 16.81 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
  • High I/O count: 960 I/Os support dense interfacing to peripherals, sensors, and high-speed external devices.
  • High-density package: The 1738-FCBGA footprint (42.5 × 42.5 mm) allows dense routing and compact board layouts for space-constrained assemblies.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to match a wide range of commercial deployment environments.
  • Regulatory compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose XC5VFX200T-2FF1738CES?

The XC5VFX200T-2FF1738CES delivers a combination of high logic density, significant on-chip memory, and extensive I/O capability in a single commercial-grade FPGA package. Its specification set is focused on designs that require large programmable resources and embedded storage while maintaining a compact, high-density package profile.

This device is suited for engineering teams and procurement looking for a scalable FPGA building block that balances integration and board-level density, with RoHS compliance and defined commercial operating limits for reliable deployment in commercial systems.

Request a quote or submit a quote today to evaluate the XC5VFX200T-2FF1738CES for your next design.

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