XC5VFX200T-2FF1738CES
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 960 16809984 196608 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,391 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 960 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15360 | Number of Logic Elements/Cells | 196608 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16809984 |
Overview of XC5VFX200T-2FF1738CES – Virtex-5 FXT FPGA, 1738-FCBGA
The XC5VFX200T-2FF1738CES is an AMD Virtex®-5 FXT Field Programmable Gate Array (FPGA) supplied in a 1738-ball FCBGA package. It provides a large programmable fabric with extensive on-chip memory and high I/O count for commercial electronic designs that require substantial logic density and embedded storage.
Key attributes include a substantial logic element count, approximately 16.81 Mbits of embedded RAM, and a high I/O complement, making the device suitable for complex digital implementations within the commercial temperature range.
Key Features
- Core logic capacity — 196,608 logic elements provide a large programmable fabric for implementing complex digital functions.
- Logic block count — 15,360 reported logic blocks to map and organize designs at block granularity.
- Embedded memory — approximately 16.81 Mbits (16,809,984 bits) of on-chip RAM for buffering, FIFO, and local storage needs.
- I/O density — 960 user I/Os to support wide parallel interfaces and multiple external peripherals.
- Package — 1738-FCBGA (42.5 × 42.5 mm) package for high-density board-level integration.
- Power — Core voltage supply range of 0.95 V to 1.05 V to match typical FPGA core power rails.
- Operating range — Commercial grade operation from 0 °C to 85 °C.
- Environmental — RoHS compliant.
Unique Advantages
- Large programmable fabric: 196,608 logic elements enable implementation of complex logic and parallel processing without external PLDs.
- Substantial on-chip RAM: Approximately 16.81 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
- High I/O count: 960 I/Os support dense interfacing to peripherals, sensors, and high-speed external devices.
- High-density package: The 1738-FCBGA footprint (42.5 × 42.5 mm) allows dense routing and compact board layouts for space-constrained assemblies.
- Commercial temperature rating: Rated for 0 °C to 85 °C to match a wide range of commercial deployment environments.
- Regulatory compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.
Why Choose XC5VFX200T-2FF1738CES?
The XC5VFX200T-2FF1738CES delivers a combination of high logic density, significant on-chip memory, and extensive I/O capability in a single commercial-grade FPGA package. Its specification set is focused on designs that require large programmable resources and embedded storage while maintaining a compact, high-density package profile.
This device is suited for engineering teams and procurement looking for a scalable FPGA building block that balances integration and board-level density, with RoHS compliance and defined commercial operating limits for reliable deployment in commercial systems.
Request a quote or submit a quote today to evaluate the XC5VFX200T-2FF1738CES for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








