XC5VFX30T-1FFG665C

The XC5VFX30T-1FFG665C is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 665-BBGA FCBGA package (27×27). It provides 2,560 CLBs and 32,768 logic elements with approximately 2.5 Mbits of on-chip RAM and 360 user I/Os, making it suitable for complex programmable logic implementations where high logic capacity and I/O density are required.

This device is commercial grade, RoHS compliant, surface-mount packaged, and specified for operation over a 0 °C to 85 °C temperature range with a core supply window of 0.95 V to 1.05 V.

Key Features

• Core / Logic  2,560 CLBs providing 32,768 logic elements to implement custom digital logic and complex processing pipelines.
• Embedded Memory  Total on-chip RAM of 2,506,752 bits (approximately 2.5 Mbits) for buffering, LUT-based storage, and state machines.
• I/O Density  360 general-purpose I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  665-BBGA, FCBGA package (665-FCBGA, 27×27) in a surface-mount form factor for PCB assembly and compact board layouts.
• Power  Core voltage supply specified from 0.95 V to 1.05 V to match system power rails and regulator designs.
• Temperature & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS compliant for regulatory alignment.

Unique Advantages

• High logic capacity: 32,768 logic elements and 2,560 CLBs enable implementation of sizeable custom logic blocks and parallel compute structures with on-chip resources close to the I/O.
• Substantial embedded memory: Approximately 2.5 Mbits of on-chip RAM supports buffering, packet handling, and temporary data storage without external memory for many designs.
• Generous I/O count: 360 I/Os provide flexibility to connect multiple interfaces, sensors, and parallel buses without external multiplexing.
• Compact, industry-standard package: The 665-BBGA FCBGA (27×27) surface-mount package enables high-density PCB integration while maintaining soldered reliability.
• Defined supply and temperature window: Clear core voltage (0.95–1.05 V) and commercial temperature rating (0–85 °C) simplify power budgeting and thermal planning for mainstream electronic products.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally aware product designs.

Why Choose XC5VFX30T-1FFG665C?

The XC5VFX30T-1FFG665C positions itself as a high-capacity, commercial-grade FPGA option for designers who need a balance of logic resources, embedded memory, and I/O density in a compact FCBGA package. Its specified supply range and temperature window make system integration predictable for a wide range of commercial electronic products.

Choose this device when your design requires substantial on-chip logic and memory capacity with broad I/O connectivity and RoHS-compliant packaging, backed by AMD’s Virtex-5 FXT family heritage and datasheet-defined specifications.

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