XC5VFX30T-2FF665I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 2506752 32768 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,231 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 32768 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2506752 |
Overview of XC5VFX30T-2FF665I – Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC, 360 I/O, 32,768 logic elements, 665-FCBGA
The XC5VFX30T-2FF665I is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC providing a balanced combination of logic, memory, and I/O resources for complex embedded designs. It delivers 32,768 logic elements implemented across 2,560 logic blocks (CLBs) and approximately 2.5 Mbits of on-chip RAM (2,506,752 bits), with up to 360 I/O.
Packaged in a 665-FCBGA (27×27) surface-mount package and specified for industrial operation from -40 °C to 100 °C, this device operates with a core voltage range of 0.95 V to 1.05 V and is RoHS compliant.
Key Features
- Logic Capacity 32,768 logic elements distributed across 2,560 logic blocks (CLBs) for substantial on-chip logic integration.
- Embedded Memory Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for data buffering and local storage.
- I/O Count Up to 360 I/O pins to support multiple external interfaces and parallel connections.
- Package & Mounting 665-FCBGA (27×27) package case; surface-mount mounting type for high-density board assembly.
- Power Supply Core voltage range of 0.95 V to 1.05 V.
- Temperature & Grade Industrial grade device specified for operation from -40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic integration: 32,768 logic elements and 2,560 CLBs enable on-chip implementation of complex logic functions.
- Substantial on-chip RAM: Approximately 2.5 Mbits of embedded memory supports local data storage and buffering needs.
- Extensive I/O capacity: 360 I/O pins support multiple external interfaces and parallel signal paths.
- Industrial operating range: Rated from -40 °C to 100 °C for deployment in industrial temperature environments.
- Compact FCBGA package: 665-FCBGA (27×27) surface-mount package for space-constrained PCB layouts.
- Low-voltage core operation: Core supply range of 0.95 V to 1.05 V to match low-voltage system domains.
Why Choose XC5VFX30T-2FF665I?
The XC5VFX30T-2FF665I positions itself as a robust Virtex®-5 FXT FPGA option for designs requiring a combination of significant logic resources, embedded memory, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require rugged, standards-conscious components.
This device is well suited to engineers and procurement teams seeking a single-chip FPGA solution that offers scalable logic capacity, on-chip RAM, and a broad I/O set while meeting industrial temperature and surface-mount packaging requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the XC5VFX30T-2FF665I.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
