XC5VFX30T-2FFG665I

The XC5VFX30T-2FFG665I is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) from AMD designed for industrial applications. It offers a balance of logic capacity, on-chip memory, and I/O density in a 665-ball FCBGA package for surface-mount assembly.

This device is suited for designs that require approximately 32,768 logic elements, around 2.5 Mbits of embedded RAM, and up to 360 I/O connections while operating across an industrial temperature range.

Key Features

• Logic Capacity — Provides 32,768 logic elements to implement complex digital logic and custom processing functions.
• Configurable Logic Blocks (CLBs) — Contains 2,560 CLBs for structured logic partitioning and design scalability.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Resources — Up to 360 I/Os to support extensive external interfacing and board-level connectivity.
• Power and Voltage — Core supply range of 0.950 V to 1.05 V for defined power planning and regulator selection.
• Package and Mounting — 665-FCBGA (27×27 mm) package, surface-mount, suitable for compact, high-density PCB implementations.
• Operating Temperature — Rated for industrial operation from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control and Automation — Use the device's industrial temperature rating, plentiful I/O, and logic resources for motor control, PLC functions, and real-time control logic.
• Communications Infrastructure — Leverage the on-chip memory and high I/O count for protocol processing, packet buffering, and interface bridging in networking equipment.
• Imaging and Signal Processing — Deploy the FPGA's logic density and embedded RAM for pixel processing, filtering, and data buffering in machine vision systems.
• Prototyping and Custom Logic — Suitable for development platforms and custom digital designs that require flexible I/O mapping and substantial programmable logic.

Unique Advantages

• Substantial Logic Density: 32,768 logic elements enable implementation of complex algorithms and sizable custom logic without immediately moving to larger device families.
• Significant On-Chip Memory: Approximately 2.5 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
• High I/O Count: 360 I/Os simplify board-level design by providing numerous direct interfaces to sensors, peripherals, and external devices.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployments in harsh or wide-temperature environments common in industrial systems.
• Compact FCBGA Package: The 665-ball FCBGA (27×27 mm) enables a compact footprint for space-constrained designs while supporting high pin counts.
• RoHS Compliance: Facilitates lead-free assembly processes and adherence to environmental regulations.

Why Choose XC5VFX30T-2FFG665I?

The XC5VFX30T-2FFG665I positions itself as a robust industrial-grade FPGA option that combines a practical balance of logic, memory, and I/O resources in a compact FCBGA package. Its defined core voltage range and industrial temperature rating make it suitable for long-life, temperature-challenging deployments where board space and interface density matter.

This device is well suited to engineering teams building industrial control systems, communications equipment, imaging and signal-processing hardware, and custom logic prototypes that require verified on-chip memory, abundant I/Os, and a durable package for surface-mount assembly.

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