XC5VFX70T-1FF1136I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 5455872 71680 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,282 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5600 | Number of Logic Elements/Cells | 71680 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VFX70T-1FF1136I – Virtex®-5 FXT Field Programmable Gate Array (FPGA), 1136-FCBGA
The XC5VFX70T-1FF1136I is a Virtex®-5 FXT field programmable gate array (FPGA) offered in a 1136-ball FCBGA / BBGA package. It delivers substantial programmable logic capacity, multi-megabit embedded memory, and a high I/O count to address complex, industrial-grade designs.
With 71,680 logic elements, approximately 5.46 Mbits of embedded memory, and 640 I/O, this device is sized for applications that require dense logic integration, extensive interfacing, and operation across a broad industrial temperature range.
Key Features
- Programmable Logic Capacity 71,680 logic elements provide extensive on-chip logic resources for implementing complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 5.46 Mbits of on-chip RAM (5,455,872 bits) for data buffering, lookup tables, and state storage within user designs.
- High I/O Count 640 general-purpose I/O pins support dense external interfacing and flexible connectivity to peripherals and subsystems.
- Package 1136-FCBGA / 1136-BBGA package in a 35×35 mm footprint, suitable for surface-mount assembly and compact system integration.
- Power Core voltage supply range of 950 mV to 1.05 V to match system power rail requirements.
- Temperature Range Industrial-grade operating range from −40 °C to 100 °C for deployment in demanding environments.
- Mounting and Compliance Surface-mount device with RoHS compliance for modern manufacturing and regulatory requirements.
Typical Applications
- Industrial Automation Used for control logic and real-time processing in industrial equipment, leveraging its industrial temperature rating, large logic capacity, and extensive I/O.
- Communications Infrastructure Suitable for protocol processing and interface aggregation where high logic density and multi-megabit on-chip memory support packet buffering and custom data handling.
- High-density I/O Systems Ideal for systems that require substantial external connectivity—640 I/O pins enable direct interfacing with sensors, transceivers, and peripherals.
- Embedded Processing and Custom Acceleration Provides on-chip resources for implementing application-specific accelerators and embedded data paths using abundant logic elements and RAM.
Unique Advantages
- Large on-chip resource pool: 71,680 logic elements and approximately 5.46 Mbits of embedded memory allow consolidation of multiple functions into a single device, reducing board-level complexity.
- Extensive external connectivity: 640 I/O pins provide design flexibility for complex interfacing without additional multiplexing hardware.
- Industrial-ready operation: Specified for −40 °C to 100 °C operation, supporting reliable deployment in temperature-challenging environments.
- Compact, manufacturable package: 1136-FCBGA / 1136-BBGA (35×35 mm) footprint supports high-density system designs and surface-mount assembly processes.
- Regulatory alignment: RoHS-compliant construction facilitates modern electronics manufacturing and environmental requirements.
Why Choose XC5VFX70T-1FF1136I?
The XC5VFX70T-1FF1136I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a combination of large programmable logic, substantial embedded memory, and broad I/O availability. Its package and surface-mount form factor enable compact system layouts while supporting industrial operating temperatures.
This device is well suited to engineering teams building complex control, communications, or high-density interface systems who need on-chip integration to reduce board-level components and simplify routing. Backed by AMD as the manufacturer, the part offers a defined set of specifications for procurement and system design.
Request a quote or contact sales to discuss availability, pricing, and lead times for the XC5VFX70T-1FF1136I.

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