XC5VFX70T-1FF1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 5455872 71680 1136-BBGA, FCBGA

Quantity 1,282 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5600Number of Logic Elements/Cells71680
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VFX70T-1FF1136I – Virtex®-5 FXT Field Programmable Gate Array (FPGA), 1136-FCBGA

The XC5VFX70T-1FF1136I is a Virtex®-5 FXT field programmable gate array (FPGA) offered in a 1136-ball FCBGA / BBGA package. It delivers substantial programmable logic capacity, multi-megabit embedded memory, and a high I/O count to address complex, industrial-grade designs.

With 71,680 logic elements, approximately 5.46 Mbits of embedded memory, and 640 I/O, this device is sized for applications that require dense logic integration, extensive interfacing, and operation across a broad industrial temperature range.

Key Features

  • Programmable Logic Capacity  71,680 logic elements provide extensive on-chip logic resources for implementing complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 5.46 Mbits of on-chip RAM (5,455,872 bits) for data buffering, lookup tables, and state storage within user designs.
  • High I/O Count  640 general-purpose I/O pins support dense external interfacing and flexible connectivity to peripherals and subsystems.
  • Package  1136-FCBGA / 1136-BBGA package in a 35×35 mm footprint, suitable for surface-mount assembly and compact system integration.
  • Power  Core voltage supply range of 950 mV to 1.05 V to match system power rail requirements.
  • Temperature Range  Industrial-grade operating range from −40 °C to 100 °C for deployment in demanding environments.
  • Mounting and Compliance  Surface-mount device with RoHS compliance for modern manufacturing and regulatory requirements.

Typical Applications

  • Industrial Automation  Used for control logic and real-time processing in industrial equipment, leveraging its industrial temperature rating, large logic capacity, and extensive I/O.
  • Communications Infrastructure  Suitable for protocol processing and interface aggregation where high logic density and multi-megabit on-chip memory support packet buffering and custom data handling.
  • High-density I/O Systems  Ideal for systems that require substantial external connectivity—640 I/O pins enable direct interfacing with sensors, transceivers, and peripherals.
  • Embedded Processing and Custom Acceleration  Provides on-chip resources for implementing application-specific accelerators and embedded data paths using abundant logic elements and RAM.

Unique Advantages

  • Large on-chip resource pool: 71,680 logic elements and approximately 5.46 Mbits of embedded memory allow consolidation of multiple functions into a single device, reducing board-level complexity.
  • Extensive external connectivity: 640 I/O pins provide design flexibility for complex interfacing without additional multiplexing hardware.
  • Industrial-ready operation: Specified for −40 °C to 100 °C operation, supporting reliable deployment in temperature-challenging environments.
  • Compact, manufacturable package: 1136-FCBGA / 1136-BBGA (35×35 mm) footprint supports high-density system designs and surface-mount assembly processes.
  • Regulatory alignment: RoHS-compliant construction facilitates modern electronics manufacturing and environmental requirements.

Why Choose XC5VFX70T-1FF1136I?

The XC5VFX70T-1FF1136I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a combination of large programmable logic, substantial embedded memory, and broad I/O availability. Its package and surface-mount form factor enable compact system layouts while supporting industrial operating temperatures.

This device is well suited to engineering teams building complex control, communications, or high-density interface systems who need on-chip integration to reduce board-level components and simplify routing. Backed by AMD as the manufacturer, the part offers a defined set of specifications for procurement and system design.

Request a quote or contact sales to discuss availability, pricing, and lead times for the XC5VFX70T-1FF1136I.

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