XC5VFX30T-3FFG665C

The XC5VFX30T-3FFG665C is a Virtex®-5 FXT field programmable gate array from AMD, delivered in a 665-ball FCBGA (27×27) surface-mount package. It combines a substantial logic fabric with significant on-chip memory and a high I/O count to support complex programmable logic applications.

With 2,560 CLBs, 32,768 logic elements, approximately 2.5 Mbits of embedded memory and up to 360 I/O, this device is suited to designs that require dense logic capacity, on-chip buffering and extensive external interfacing within a commercial 0 °C to 85 °C operating range.

Key Features

• Core Logic — 2,560 CLBs providing a total of 32,768 logic elements for implementing custom digital logic and state machines.
• On‑Chip Memory — Approximately 2.5 Mbits of embedded RAM for FIFOs, buffers and local data storage.
• I/O Density — Up to 360 I/O pins to support multiple external interfaces and parallel connectivity.
• Power — Core voltage supply range of 950 mV to 1.05 V to match system power domains.
• Package & Mounting — 665-FCBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C, RoHS compliant.

Typical Applications

• High‑density I/O systems — Use the 360 available I/O pins to aggregate interfaces, implement protocol bridging and manage multiple external peripherals.
• Memory‑intensive buffering — Leverage approximately 2.5 Mbits of embedded RAM for on-chip buffering, FIFOs and low-latency data staging.
• Custom digital processing — Deploy 32,768 logic elements and 2,560 CLBs for application-specific datapaths, state machines and control logic.

Unique Advantages

• High logic capacity: 32,768 logic elements and 2,560 CLBs provide the resources to implement complex logic functions without external ASICs.
• Substantial on‑chip memory: Approximately 2.5 Mbits of embedded RAM reduces external memory dependency for buffering and temporary storage.
• Extensive I/O: Up to 360 I/O pins enable complex system interfacing and multiple peripheral connections on a single device.
• Compact surface‑mount package: 665‑FCBGA (27×27) allows high-density PCB layouts while preserving device routing and signal integrity options.
• Commercial temperature and compliance: RoHS compliant and specified for 0 °C to 85 °C operation for standard commercial applications.

Why Choose XC5VFX30T-3FFG665C?

This Virtex®-5 FXT FPGA balances significant logic resources, embedded memory and a high I/O count in a compact 665‑ball FCBGA package, addressing designs that need integrated logic, buffering and extensive interfacing within commercial temperature ranges. As an AMD Virtex‑5 FXT device, it is positioned for projects requiring robust programmable logic capacity with on‑chip memory and flexible I/O.

Choose the XC5VFX30T-3FFG665C for designs that demand a combination of logic density, embedded memory and I/O scalability while maintaining a compact surface-mount footprint and compliance with RoHS requirements.

Request a quote or submit an inquiry to purchase the XC5VFX30T-3FFG665C and discuss availability and procurement options for your design.