XC5VFX70T-1FF1136C

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 5455872 71680 1136-BBGA, FCBGA

Quantity 1,535 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5600Number of Logic Elements/Cells71680
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VFX70T-1FF1136C – Virtex®-5 FXT Field Programmable Gate Array (FPGA)

The XC5VFX70T-1FF1136C is a Virtex-5 FXT field programmable gate array (FPGA) IC offering high logic capacity and on-chip memory for complex programmable designs. It delivers 71,680 logic elements and approximately 5.456 Mbits of embedded memory to support dense logic and buffering requirements.

This device features 640 I/O pins in a compact 1136-FCBGA (35 × 35) surface-mount package, operates from a 0.95 V to 1.05 V supply, and is rated for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core Logic  71,680 logic elements provide substantial capacity for implementing complex logic functions and parallel processing pipelines.
  • Embedded Memory  Approximately 5.456 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage without external memory for many use cases.
  • I/O  640 user I/O pins enable broad interfacing options to peripherals, mezzanine cards, and companion devices.
  • Package & Mounting  1136-ball FCBGA (35 × 35) package in a surface-mount configuration for compact board-level integration.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to match system power rails and design constraints.
  • Temperature & Grade  Commercial operating range of 0 °C to 85 °C, suitable for standard commercial electronics environments.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing processes.

Unique Advantages

  • High Logic Density: 71,680 logic elements enable integration of sizable digital subsystems and custom accelerators within a single device.
  • Substantial On‑Chip Memory: Approximately 5.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O Count: 640 I/O pins allow flexible routing to external sensors, converters, and interfaces without additional I/O expanders.
  • Compact, Assembly‑Ready Package: 1136-FCBGA (35 × 35) surface-mount package supports high-density PCB layouts while maintaining a standard ball-grid footprint.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C for deployment in standard commercial applications.
  • RoHS Compliance: Conforms to lead-free manufacturing requirements.

Why Choose XC5VFX70T-1FF1136C?

The XC5VFX70T-1FF1136C is positioned for designs that require significant programmable logic capacity, embedded memory, and a high number of I/O in a compact FCBGA package. Its combination of 71,680 logic elements, approximately 5.456 Mbits of on‑chip RAM, and 640 I/O pins makes it suitable for complex FPGA-based implementations where integration and board-level compactness matter.

With a commercial temperature rating and RoHS compliance, this Virtex-5 FXT device is a practical choice for commercial electronics projects that need a balance of logic density, memory, and I/O connectivity within defined supply voltage and thermal limits.

Request a quote or submit a pricing inquiry for XC5VFX70T-1FF1136C to check availability and receive ordering information.

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