XC5VFX70T-1FF665CES

The XC5VFX70T-1FF665CES is a Virtex‑5 FXT family FPGA IC from AMD, provided in a 665‑ball FCBGA package (27×27 mm). This device integrates a large logic fabric, multi-megabit on‑chip RAM, and extensive I/O in a surface‑mount form factor.

Its specified electrical and environmental operating ranges — a core supply range of 0.950 V to 1.05 V and an operating temperature range of 0 °C to 85 °C — make it suitable for commercial designs that require substantial logic capacity, embedded memory, and a high count of I/O pins.

Key Features

• Logic Capacity — 71,680 logic elements to implement large-scale custom logic and parallel functions within a single device.
• Configurable Logic Blocks (CLBs) — 5,600 CLBs for structured logic partitioning and resource allocation.
• Embedded Memory — approximately 5.456 Mbits of embedded memory for buffering, lookup tables, and on‑chip data storage.
• I/O Count — 360 user I/O pins to support multiple interfaces and high‑density signal routing.
• Package and Mounting — 665‑ball FCBGA (27×27 mm) package, surface‑mount mounting for board‑level integration.
• Power and Temperature — Core supply range 0.950 V to 1.05 V and commercial operating temperature from 0 °C to 85 °C.
• Compliance — RoHS‑compliant components for environmental conformity in applicable regions.

Typical Applications

• High‑density custom logic — Use the device's 71,680 logic elements to implement complex, large‑scale FPGA designs within a single IC.
• Memory‑dependent processing — Approximately 5.456 Mbits of embedded memory supports buffering, data staging, and on‑chip storage requirements.
• I/O‑rich interface bridging — With 360 I/O pins, the device can serve as a central interface hub for boards requiring many signals or mixed interfaces.

Unique Advantages

• Substantial on‑chip resources: Combines tens of thousands of logic elements with multi‑megabit embedded memory to consolidate functions into a single FPGA.
• High I/O integration: 360 I/O pins reduce the need for external I/O expanders and simplify board routing for signal‑dense designs.
• Compact, board‑ready package: 665‑ball FCBGA (27×27 mm) surface‑mount package supports dense PCB layouts while providing robust connectivity.
• Commercial operating range: Specified operation from 0 °C to 85 °C suits standard commercial electronics applications.
• Manufacturer support and documentation: Product is supplied by AMD with an accompanying datasheet for design and implementation reference.
• RoHS compliant: Meets RoHS requirements for environmentally regulated assemblies.

Why Choose XC5VFX70T-1FF665CES?

The XC5VFX70T-1FF665CES positions itself as a resource‑rich FPGA option for commercial designs that require a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its defined supply and temperature ranges provide clear electrical and environmental boundaries for system integration.

This device is suitable for teams and projects that need to consolidate multiple functions into a single programmable device, reduce external component count, and rely on manufacturer documentation for implementation. The combination of logic resources, on‑chip RAM, and dense I/O offers a scalable platform for complex digital designs.

Request a quote or submit your requirements to receive pricing and availability for the XC5VFX70T-1FF665CES.