XC5VFX70T-1FFG1136CES

The XC5VFX70T-1FFG1136CES is a Virtex®-5 FXT field programmable gate array (FPGA) IC from AMD, supplied in a 1136‑FBGA (1136‑FCBGA, 35×35) package and intended for surface-mount assembly. It combines large logic capacity, substantial embedded memory, and a high I/O count to support designs that require dense logic integration and extensive interfacing within a commercial temperature range.

Key Features

• Logic Capacity — 5,600 CLBs providing 71,680 logic elements for implementing complex custom logic and control functions.
• Embedded Memory — Approximately 5.46 Mbits of on-chip RAM available for data buffering, packet handling, and local storage.
• I/O Density — 640 user I/O pins to support multi-channel interfaces, parallel buses, and high-pin-count connector systems.
• Power and Voltage — Core voltage supply range from 0.95 V to 1.05 V to match system power rails and regulator designs.
• Package and Mounting — 1136‑FBGA (35×35) FCBGA package designed for surface-mount PCB assembly, enabling a compact, high-density board footprint.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for typical electronic equipment environments.
• RoHS Compliance — Environmentally compliant for lead-free manufacturing processes.

Typical Applications

• High‑density I/O systems — Use the 640 I/O pins to connect multiple sensors, converters, and external interfaces in a single FPGA solution.
• Custom logic and control — Leverage 71,680 logic elements to implement complex state machines, protocol handling, and control algorithms.
• Data buffering and local memory — Approximately 5.46 Mbits of embedded RAM for packet buffering, FIFO implementations, and temporary data storage close to processing logic.
• Compact board designs — The 1136‑FCBGA package supports high integration in space-constrained PCBs while maintaining surface-mount assembly compatibility.

Unique Advantages

• High logic density: 71,680 logic elements enable integration of large amounts of custom logic without external gate arrays.
• Substantial on-chip memory: Approximately 5.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• Extensive I/O support: 640 I/O pins simplify board-level routing for multi-channel designs and rich peripheral connectivity.
• Compact FCBGA package: The 1136‑FBGA (35×35) package lets designers keep board area small while supporting high pin counts.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard electronic equipment environments.
• RoHS compliant: Suitable for lead‑free manufacturing processes and environmentally conscious designs.

Why Choose XC5VFX70T-1FFG1136CES?

The XC5VFX70T-1FFG1136CES positions itself as a high-capacity FPGA option offering a balance of dense logic, embedded memory, and large I/O count within a single 1136‑FCBGA package. Its specifications make it well suited for designs that require substantial on-chip resources and numerous external interfaces while maintaining a commercial operating profile.

Engineers and procurement teams looking for a robust, RoHS-compliant FPGA solution will find this part appropriate for projects that prioritize integration and board-level density, with clear electrical and thermal parameters to guide system-level power and cooling decisions.

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