XC5VFX70T-1FFG665CES

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 360 5455872 71680 665-BBGA, FCBGA

Quantity 1,049 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5600Number of Logic Elements/Cells71680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VFX70T-1FFG665CES – Virtex®-5 FXT FPGA, 665-FCBGA

The XC5VFX70T-1FFG665CES is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC from AMD presented in a 665-ball FCBGA package. It provides a large logic resource set, substantial on-chip RAM, and a high I/O count in a surface-mount form factor for commercial-temperature applications.

Engineers can leverage the part’s 71,680 logic element cells, approximately 5.46 Mbits of embedded memory, and 360 I/O to implement complex programmable logic and dense interfacing within designs that operate across a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity  71,680 logic element cells to support complex custom logic implementation and large-scale programmable designs.
  • Embedded Memory  Approximately 5.46 Mbits of on-chip RAM for buffering, local data storage, and state machines.
  • I/O Resources  360 user I/O pins to enable broad peripheral and interface connectivity directly from the FPGA.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V to match system-level power delivery requirements.
  • Package & Mounting  665-ball FCBGA (665-BBGA) surface-mount package in a 27×27 mm footprint for compact board integration.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard industrial and commercial deployments.
  • Compliance  RoHS-compliant construction.

Typical Applications

  • I/O‑intensive systems  360 I/O pins enable interfacing with multiple peripherals, sensors, or parallel buses in complex systems.
  • Memory‑dependent logic  Approximately 5.46 Mbits of embedded RAM provide on-chip buffering and storage for data paths and packet handling.
  • High‑capacity programmable logic  71,680 logic element cells support dense custom logic blocks, protocol engines, and algorithmic acceleration.
  • Compact board designs  665-ball FCBGA (27×27 mm) surface-mount package allows integration in space-constrained PCBs.

Unique Advantages

  • High logic density: 71,680 logic element cells provide the capacity to implement large and complex FPGA designs without external logic expansion.
  • Significant on-chip memory: Approximately 5.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-handling tasks.
  • Extensive I/O: 360 I/O pins enable flexible interfacing and simplify system-level connectivity.
  • Compact FCBGA package: 665-ball, 27×27 mm surface-mount package supports high-density PCB layouts while maintaining robust connectivity.
  • Low-voltage core support: 0.95 V to 1.05 V supply range aligns with modern power-rail architectures.
  • RoHS compliant: Environmentally compliant manufacturing and materials.

Why Choose XC5VFX70T-1FFG665CES?

The XC5VFX70T-1FFG665CES brings together large programmable logic capacity, meaningful embedded memory, and a high pin count in a compact 665-FCBGA package, making it suited for commercial designs that require dense logic and flexible interfacing. Its supply voltage range and commercial operating temperature make it compatible with typical system power architectures and deployment environments.

Backed by AMD documentation, this Virtex®-5 FXT FPGA is a practical choice for engineers seeking a scalable, board‑level programmable solution with on-chip resources to reduce external BOM and streamline system design.

Request a quote or submit a procurement inquiry to begin the sourcing process for XC5VFX70T-1FFG665CES.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up