XC5VFX70T-2FF665I

The XC5VFX70T-2FF665I is a Virtex-5 FXT Field Programmable Gate Array (FPGA) IC from AMD. It combines a high logic capacity and substantial on-chip memory with a large number of I/O to support complex, custom digital designs.

With 71,680 logic elements, approximately 5.46 Mbits of embedded memory and 360 user I/Os in a 665-FCBGA surface-mount package, this device is suited for designs that require dense logic implementation, significant buffering or state storage, and broad external connectivity within industrial temperature ranges.

Key Features

• Core Logic: 5600 CLBs delivering a total of 71,680 logic elements for implementation of complex custom logic and datapaths.
• Embedded Memory: Approximately 5.46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive state machines.
• I/O Capacity: 360 user I/Os providing extensive external connectivity for peripherals, sensors, and parallel interfaces.
• Package & Mounting: 665-FCBGA package (27×27) / 665-BBGA package in a surface-mount form factor to suit compact, high-density board layouts.
• Power Supply: Core voltage range of 950 mV to 1.05 V for compatibility with specified power rails and regulator designs.
• Temperature & Grade: Industrial-grade device rated for operation from –40°C to 100°C, enabling use in industrial environments.
• Regulatory Compliance: RoHS compliant.

Typical Applications

• Industrial Control and Automation: Industrial-grade temperature range and extensive I/O support implementation of control logic, motor drivers, and sensor interfacing in factory and process equipment.
• Logic-Intensive Custom Hardware: Large CLB and logic element counts enable complex state machines, custom accelerators, and protocol handling in FPGA-based systems.
• Memory-Dependent Designs: Approximately 5.46 Mbits of embedded RAM supports buffering, packet processing, and temporary data storage for real-time processing tasks.
• High-Connectivity Systems: 360 I/Os allow interfacing to multiple peripherals, parallel buses, and external devices for system integration and prototyping.

Unique Advantages

• High Logic Density: 71,680 logic elements across 5600 CLBs enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 5.46 Mbits of embedded RAM provides local storage for buffering and state retention, minimizing external memory dependence.
• Generous I/O Count: 360 user I/Os support broad peripheral integration and flexible interfacing options without additional ICs.
• Industrial Temperature Range: Rated from –40°C to 100°C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 665-FCBGA (27×27) surface-mount package enables dense PCB layouts for space-constrained applications.
• RoHS Compliant: Meets RoHS requirements for material compliance in manufacturing.

Why Choose XC5VFX70T-2FF665I?

The XC5VFX70T-2FF665I positions itself as a high-density, industrial-grade FPGA option with a balance of logic capacity, embedded memory, and extensive I/O in a compact surface-mount 665-FCBGA package. Its specified core voltage range and wide operating temperature span make it suitable for robust embedded and industrial designs that demand on-chip resources and reliable operation.

Designed and manufactured by AMD, this Virtex-5 FXT device is appropriate for engineers and product teams building complex custom hardware where consolidation of logic, local memory, and multi-channel interfacing reduces system complexity and BOM count.

Request a quote today to evaluate the XC5VFX70T-2FF665I for your next FPGA-based design or to obtain pricing and availability details.