XC5VFX70T-2FFG1136I
| Part Description |
Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 5455872 71680 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,334 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5600 | Number of Logic Elements/Cells | 71680 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VFX70T-2FFG1136I – Virtex®-5 FXT FPGA, 1136-FCBGA (35×35)
The XC5VFX70T-2FFG1136I is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC. It integrates 71,680 logic elements and approximately 5.46 Mbits of embedded memory with 640 user I/O in an industrial-grade 1136-FCBGA (35×35) package. The device operates from a core supply of 0.95 V to 1.05 V, supports surface-mount assembly, and is rated for an operating temperature range of -40 °C to 100 °C.
Key Features
- Core and Logic 71,680 logic elements for implementing complex programmable logic and control functions.
- Embedded Memory Approximately 5.46 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
- I/O and Package 640 user I/O pins in a 1136-BBGA / 1136-FCBGA (35×35) package offering a high I/O count in a compact ball-grid format.
- Power Core voltage range from 0.95 V to 1.05 V for compatibility with specified power rails.
- Temperature and Grade Industrial grade device rated for operation from -40 °C to 100 °C.
- Mounting and Compliance Surface-mount FCBGA package; RoHS compliant for environmental substance requirements.
Unique Advantages
- High logic density: 71,680 logic elements enable dense implementation of programmable logic on a single device.
- Significant embedded memory: Approximately 5.46 Mbits of on-chip RAM reduces dependence on external memory for many designs.
- Extensive I/O capacity: 640 I/O pins accommodate multiple external interfaces and peripherals without board-level multiplexing.
- Industrial temperature range: Rated -40 °C to 100 °C for deployments that require extended environmental tolerance.
- Compact, standardized package: 1136-FCBGA (35×35) footprint provides a dense, manufacturable solution for system integration.
- RoHS compliant: Supports environmental compliance requirements in assemblies and finished products.
Why Choose XC5VFX70T-2FFG1136I?
The XC5VFX70T-2FFG1136I delivers a balance of high logic capacity, substantial on-chip memory, and a large I/O complement in a single industrial-grade FPGA package. Its defined core voltage range and surface-mount FCBGA footprint support integration into compact, industrial designs where on-board programmable logic and memory are required.
This device is appropriate for engineering teams and procurement professionals seeking a Virtex®-5 FXT FPGA that combines integration, thermal tolerance, and a high I/O count for demanding embedded and industrial applications.
Request a quote or submit a pricing inquiry for the XC5VFX70T-2FFG1136I to get availability and pricing information tailored to your volume and delivery needs.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








