XC5VFX70T-2FFG1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC 640 5455872 71680 1136-BBGA, FCBGA

Quantity 1,334 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5600Number of Logic Elements/Cells71680
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VFX70T-2FFG1136I – Virtex®-5 FXT FPGA, 1136-FCBGA (35×35)

The XC5VFX70T-2FFG1136I is a Virtex®-5 FXT Field Programmable Gate Array (FPGA) IC. It integrates 71,680 logic elements and approximately 5.46 Mbits of embedded memory with 640 user I/O in an industrial-grade 1136-FCBGA (35×35) package. The device operates from a core supply of 0.95 V to 1.05 V, supports surface-mount assembly, and is rated for an operating temperature range of -40 °C to 100 °C.

Key Features

  • Core and Logic 71,680 logic elements for implementing complex programmable logic and control functions.
  • Embedded Memory Approximately 5.46 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
  • I/O and Package 640 user I/O pins in a 1136-BBGA / 1136-FCBGA (35×35) package offering a high I/O count in a compact ball-grid format.
  • Power Core voltage range from 0.95 V to 1.05 V for compatibility with specified power rails.
  • Temperature and Grade Industrial grade device rated for operation from -40 °C to 100 °C.
  • Mounting and Compliance Surface-mount FCBGA package; RoHS compliant for environmental substance requirements.

Unique Advantages

  • High logic density: 71,680 logic elements enable dense implementation of programmable logic on a single device.
  • Significant embedded memory: Approximately 5.46 Mbits of on-chip RAM reduces dependence on external memory for many designs.
  • Extensive I/O capacity: 640 I/O pins accommodate multiple external interfaces and peripherals without board-level multiplexing.
  • Industrial temperature range: Rated -40 °C to 100 °C for deployments that require extended environmental tolerance.
  • Compact, standardized package: 1136-FCBGA (35×35) footprint provides a dense, manufacturable solution for system integration.
  • RoHS compliant: Supports environmental compliance requirements in assemblies and finished products.

Why Choose XC5VFX70T-2FFG1136I?

The XC5VFX70T-2FFG1136I delivers a balance of high logic capacity, substantial on-chip memory, and a large I/O complement in a single industrial-grade FPGA package. Its defined core voltage range and surface-mount FCBGA footprint support integration into compact, industrial designs where on-board programmable logic and memory are required.

This device is appropriate for engineering teams and procurement professionals seeking a Virtex®-5 FXT FPGA that combines integration, thermal tolerance, and a high I/O count for demanding embedded and industrial applications.

Request a quote or submit a pricing inquiry for the XC5VFX70T-2FFG1136I to get availability and pricing information tailored to your volume and delivery needs.

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