XC5VFX70T-2FFG1136C

The XC5VFX70T-2FFG1136C is a Virtex‑5 FXT field programmable gate array from AMD, supplied in a 1136‑ball FCBGA package. It combines a high logic capacity with substantial on‑chip RAM and a large I/O count for demanding programmable-logic designs.

Key device parameters include 71,680 logic elements, approximately 5.46 Mbits of embedded memory, 640 I/O pins, a core supply range of 950 mV to 1.05 V, and a commercial operating range of 0 °C to 85 °C.

Key Features

• Logic Capacity  71,680 logic elements for implementing complex custom logic and large-scale programmable functions.
• Embedded Memory  Approximately 5.46 Mbits of on‑chip RAM to support buffering, data storage, and memory‑intensive functions without external SRAM.
• I/O  Up to 640 programmable I/O pins to accommodate high‑pin‑count interfaces and multi‑channel designs.
• Power  Core voltage supply range of 950 mV to 1.05 V to match system power rails and support low‑voltage FPGA operation.
• Package and Mounting  1136‑ball BGA (1136‑FCBGA) surface‑mount package; supplier device package specified as 1136‑FCBGA (35 × 35 mm) for compact board integration.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting environmental and manufacturing requirements for lead‑free assembly.

Typical Applications

• Logic‑intensive system design  Suitable for designs that require up to 71,680 logic elements for custom digital functions and complex state machines.
• Memory‑dependent processing  On‑chip RAM (approximately 5.46 Mbits) supports buffering, FIFOs, and localized data storage to reduce external memory needs.
• High‑I/O board designs  With up to 640 I/O pins, this device fits applications that need large numbers of parallel or multi‑channel interfaces.
• Compact surface‑mount assemblies  The 1136‑ball FCBGA (35 × 35 mm) package is intended for board‑level integration where a high‑density FPGA is required.

Unique Advantages

• High on‑chip integration: Combines a large logic element count and several Mbits of embedded RAM to reduce reliance on external components.
• Extensive I/O capacity: 640 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and buses.
• Compact package footprint: 1136‑ball FCBGA (35 × 35 mm) enables dense board layouts while keeping the device surface‑mount compatible.
• Low‑voltage core operation: Core supply range of 0.95–1.05 V supports integration with modern low‑voltage power architectures.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation, suitable for a wide range of standard electronic applications.
• RoHS compliant: Meets lead‑free manufacturing requirements for many production environments.

Why Choose XC5VFX70T-2FFG1136C?

The XC5VFX70T-2FFG1136C positions itself as a high‑capacity Virtex‑5 FXT FPGA option from AMD, offering a substantial logic fabric, multi‑Mbit on‑chip RAM, and hundreds of I/O pins in a 1136‑ball FCBGA package. It is appropriate for engineering teams that need significant programmable logic and memory resources in a compact, surface‑mount form factor.

For projects requiring a commercial‑grade FPGA with well‑documented electrical limits—including a 0.95–1.05 V core supply window and 0 °C to 85 °C operating range—this device provides a clear specification package to support design, procurement, and production planning.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VFX70T-2FFG1136C and to discuss your design requirements with our technical team.