XC5VFX70T-2FFG665I

The XC5VFX70T-2FFG665I is a Virtex®-5 FXT field programmable gate array (FPGA) IC from AMD, delivered in a 665-ball FCBGA (27×27) surface-mount package. It provides a large pool of programmable logic and embedded memory, along with a high I/O count and an industrial operating temperature range.

This device targets designs that require up to 71,680 logic elements, approximately 5.46 Mbits of embedded memory, and up to 360 I/O connections while operating between −40 °C and 100 °C, with a nominal core supply range of 0.95 V to 1.05 V.

Key Features

• Core and Logic  Virtex-5 FXT FPGA architecture providing 71,680 logic elements and 5,600 configurable logic blocks (CLBs) for large-scale programmable logic implementation.
• Embedded Memory  Approximately 5.46 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O Capacity  Up to 360 general-purpose I/O pins to support dense external interfacing and multi-channel connectivity.
• Power  Core voltage supply specified between 0.95 V and 1.05 V to match system power budgets requiring this range.
• Package and Mounting  665-ball FCBGA (27×27) package in a surface-mount form factor for compact, high-density board implementations.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in environments with wide temperature variation.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use where industrial temperature range and substantial logic and I/O resources are required for control, monitoring, and real-time decision logic.
• High-Density I/O Interfaces  Suitable for designs that need numerous external connections—up to 360 I/O—to aggregate sensors, actuators, or communication channels.
• Embedded Processing Modules  Applicable to embedded systems that need significant on-chip RAM and logic elements for custom processing and buffering tasks.

Unique Advantages

• High logic capacity: 71,680 logic elements enable complex, large-scale programmable designs without immediate partitioning to multiple devices.
• Substantial on-chip memory: Approximately 5.46 Mbits of embedded RAM reduces external memory dependencies for many applications.
• Extensive I/O count: 360 I/O pins support multi-channel interfacing and simplify routing of numerous signals to a single FPGA.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact, high-density package: 665-ball FCBGA (27×27) delivers a dense footprint for board-level integration while preserving a large resource set.
• RoHS compliant: Meets common materials and environmental requirements.

Why Choose XC5VFX70T-2FFG665I?

The XC5VFX70T-2FFG665I combines a Virtex-5 FXT FPGA architecture with large logic and memory resources, a high I/O count, and an industrial operating range—packaged in a 665-ball FCBGA for compact board designs. These attributes make it well suited for engineering projects that require substantial programmable logic, embedded memory, and broad external connectivity within an industrial temperature envelope.

Manufactured by AMD and offered as a surface-mount, RoHS-compliant device, this part is appropriate for development and production environments where the listed electrical, thermal, and package specifications match system requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VFX70T-2FFG665I and to discuss how its specified resources align with your design needs.